Chip Consolidation Nearly Over, Analyst Says
Alan Patterson, EETimes
9/14/2017 06:01 PM EDT
TAIPEI — After about three years and hundreds of billions of dollars in mergers and acquisitions, the consolidation of the global semiconductor industry is pretty much finished, according to Bill Wiseman, a senior partner with management consultancy McKinsey.
“The issue is that there aren’t a whole lot of deals left,” said Wiseman, who prior to joining McKinsey in 2001 was designing mixed-signal integrated circuits for IBM and before that was a U.S. Navy Seal. “There aren’t that many deals left because there aren’t that many attractive targets out there.”
To read the full article, click here
Related Semiconductor IP
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
- nQrux® Root of Trust IP
- AXI to UCIe Bridge IP
Related News
- Amkor nearly doubles 1Q net income to $37M
- ARC Announces Consolidation of Software Engineering Teams and Provides a Trading Update
- Gartner Says Worldwide Semiconductor IP Industry Grows 21 Percent in 2004 as Industry Experiences Significant Consolidation
- TSMC Says Immersion Lithography Nearly Production Ready
Latest News
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools
- Vayavya Labs and Tenstorrent Partner to Accelerate RISC-V Hardware and Software Development Through Virtual Platform Modeling
- RaiderChip’s Edge NPU reaches more than 50 Generative AI Models with the addition of Qwen3.8-27B