Chip Consolidation Nearly Over, Analyst Says
Alan Patterson, EETimes
9/14/2017 06:01 PM EDT
“The issue is that there aren’t a whole lot of deals left,” said Wiseman, who prior to joining McKinsey in 2001 was designing mixed-signal integrated circuits for IBM and before that was a U.S. Navy Seal. “There aren’t that many deals left because there aren’t that many attractive targets out there.”
To read the full article, click here
Related Semiconductor IP
- AP Memory VHM Controller
- High-performance, commercial-grade RISC-V CPU Core IP
- SWI3S Verification IP
- Secure Boot Loader
- Memory Subsystem
Related News
- Amkor nearly doubles 1Q net income to $37M
- ARC Announces Consolidation of Software Engineering Teams and Provides a Trading Update
- Gartner Says Worldwide Semiconductor IP Industry Grows 21 Percent in 2004 as Industry Experiences Significant Consolidation
- TSMC Says Immersion Lithography Nearly Production Ready
Latest News
- proteanTecs Unveils Advanced Packaging Solutions to Improve Yield, Performance, and Reliability of Multi-Die Systems
- StarFive Launches Server-Class RISC-V IP to Accelerate Its Strategic Expansion into AI Computing Infrastructure
- Silvaco Announces Partnership with Dassault Systèmes to Advance First-Time-Right Semiconductor Manufacturing
- Socionext Broadens SoC Roadmap with Intel 18A-P Process Technology
- BrainChip and Neuromorphyx Announce an AKD1500 Embedded Developer Board, Bringing Neuromorphic AI to the Embedded Engineering Community