Ceva-ZTE Deal Hints Home-Grown ASIC Is Back
Junko Yoshida, EETimes
8/13/2013 06:33 PM EDT
ADISON, Wis. — Ceva Inc. disclosed on Tuesday, August 13 that it has signed Chinese telecom equipment supplier ZTE as a new licensee for its Ceva-XC DSP core. ZTE's microelectronics division will be using Ceva's DSP to design LTE TDD/FDD multi-mode SoCs to power its upcoming base stations for the global market.
The announcement offers a glimpse at two forces currently sweeping the electronics industry: a growing appetite among first-tier OEMs to develop their own ASICs to power their systems, as opposed to buying third-party ASSPs; and the growing traction for TD-LTE in China.
To read the full article, click here
Related Semiconductor IP
- Vision 341 DSP
- Tensilica HiFi 3z DSP
- Tensilica HiFi 4 DSP
- High performance dual-issue, out-of-order, 7-stage Vector processor (DSP) IP
- Versatile, Ultra-Low-Power DSP for Audio, Voice, Vision, and AI
Related News
- SiliconAlly: GigaPHY Testchip is back from Fabrication and Packaging
- What Is Holding Back Neuromorphic Computing?
- Need a Perfect Ethernet IP? Key ASIC's 0.13um 10/100 PHY IP Solution is Ready Now
- Is Imagination Technologies China’s backdoor to AI tech?
Latest News
- VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications
- Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
- Tenstorrent Sets New Performance Records, Launches TT- Ascalon S, and Expands Across Japan
- Chips&Media Signs APV codec IP Licensing Deal with North American Big Tech, Establishing the ‘Second Front’ Against Apple’s ProRes
- Chipsolve Technologies Appoints Balaji Kanigicherla as Chairman of the Board