Ceva-ZTE Deal Hints Home-Grown ASIC Is Back
Junko Yoshida, EETimes
8/13/2013 06:33 PM EDT
ADISON, Wis. — Ceva Inc. disclosed on Tuesday, August 13 that it has signed Chinese telecom equipment supplier ZTE as a new licensee for its Ceva-XC DSP core. ZTE's microelectronics division will be using Ceva's DSP to design LTE TDD/FDD multi-mode SoCs to power its upcoming base stations for the global market.
The announcement offers a glimpse at two forces currently sweeping the electronics industry: a growing appetite among first-tier OEMs to develop their own ASICs to power their systems, as opposed to buying third-party ASSPs; and the growing traction for TD-LTE in China.
To read the full article, click here
Related Semiconductor IP
- Vision 341 DSP
- Tensilica HiFi 3z DSP
- Tensilica HiFi 4 DSP
- High performance dual-issue, out-of-order, 7-stage Vector processor (DSP) IP
- Versatile, Ultra-Low-Power DSP for Audio, Voice, Vision, and AI
Related News
- SiliconAlly: GigaPHY Testchip is back from Fabrication and Packaging
- What Is Holding Back Neuromorphic Computing?
- Need a Perfect Ethernet IP? Key ASIC's 0.13um 10/100 PHY IP Solution is Ready Now
- Is Imagination Technologies China’s backdoor to AI tech?
Latest News
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools