Ceva-ZTE Deal Hints Home-Grown ASIC Is Back
Junko Yoshida, EETimes
8/13/2013 06:33 PM EDT
ADISON, Wis. — Ceva Inc. disclosed on Tuesday, August 13 that it has signed Chinese telecom equipment supplier ZTE as a new licensee for its Ceva-XC DSP core. ZTE's microelectronics division will be using Ceva's DSP to design LTE TDD/FDD multi-mode SoCs to power its upcoming base stations for the global market.
The announcement offers a glimpse at two forces currently sweeping the electronics industry: a growing appetite among first-tier OEMs to develop their own ASICs to power their systems, as opposed to buying third-party ASSPs; and the growing traction for TD-LTE in China.
To read the full article, click here
Related Semiconductor IP
- Vision 341 DSP
- Tensilica HiFi 3z DSP
- Tensilica HiFi 4 DSP
- High performance dual-issue, out-of-order, 7-stage Vector processor (DSP) IP
- Versatile, Ultra-Low-Power DSP for Audio, Voice, Vision, and AI
Related News
- SiliconAlly: GigaPHY Testchip is back from Fabrication and Packaging
- What Is Holding Back Neuromorphic Computing?
- Need a Perfect Ethernet IP? Key ASIC's 0.13um 10/100 PHY IP Solution is Ready Now
- Is Imagination Technologies China’s backdoor to AI tech?
Latest News
- Brite Semiconductor Releases 28nm High-Performance SAR ADC IP, Driving Upgrades for High-Speed Signal Chain Applications
- Synopsys Updates CXL IP Portfolio for AI-Era Infrastructure
- BrainChip Launches Symphony Community Akida Bundle For IBM’s Workload Management Solution
- StarIC Appoints Dr. Masum Hossain as Chief Technology Officer
- Andes Technology Empowers RISC-V Developers with Its New Streamlined IDE, RVBuilder