BOS Semiconductors Joins Arm Total Design for Physical AI
September 9, 2026 -- BOS Semiconductors has joined Arm Total Design for Physical AI, a growing ecosystem bringing together more than 80 companies across the technology stack to accelerate the development and deployment of next-generation Physical AI systems.
As artificial intelligence expands beyond the digital world into vehicles, robots, and autonomous systems, Physical AI requires increasingly powerful and efficient computing solutions, as well as close collaboration across the semiconductor and technology ecosystem.
BOS Semiconductors is developing high-performance, scalable AI SoCs for Physical AI and automotive and applications. Our portfolio includes chiplet-based AI SoCs and custom ASIC solutions, designed to address diverse computing requirements and enable greater flexibility and scalability for next-generation intelligent systems.

By participating in Arm Total Design for Physical AI, BOS will collaborate with Arm and ecosystem partners to explore new opportunities across the Physical AI technology stack and help accelerate the journey from innovation to real-world deployment.
BOS looks forward to contributing its AI semiconductor and custom silicon expertise to the growing ecosystem and advancing the development of scalable silicon solutions for automotive, robotics, and broader Physical AI applications.

🔗 Learn more about Arm Total Design for Physical AI: https://www.arm.com/markets/physical-ai/arm-total-design
Related Semiconductor IP
- UMC 55nm ULP 3.3V Temperature Sensor
- High-Throughput Multi-Channel DMA Controller
- Configurable Multi-Channel DMA Controller
- Fixed-Channel Multi-Channel DMA Controller
- Verification IP for MIPI SoundWire
Related News
- TIER IV joins Arm Total Design for Physical AI to accelerate ready-to-use Autoware solutions through Open AD Kit
- Alchip Joins Arm Total Design Ecosystem
- Astera Labs Joins Arm Total Design to Accelerate Custom AI Infrastructure Solutions
- VIA NEXT Joins Arm Total Design Ecosystem to Accelerate Next-Generation AI and HPC Innovations
Latest News
- Alliance for Open Media Sees Rapid AV2 Adoption Across the Video Ecosystem Just Four Months After Release
- Rambus and ChipAgents Collaborate to Accelerate Chip Design with Agentic AI
- Server CPU Shipments Projected to Grow Over 40% YoY in 2027, with Arm-Based Products Continuing to Gain Market Share
- UMC and AP Memory Collaborate to Enable Advanced Power Delivery Solutions for AI and HPC Systems
- Cadence AI Super Agents Enable Nokia to Accelerate Electronic System Design on Millennium M2000 Supercomputer