K-micro to Sample IEEE 1901 Compliant, Single Chip HD-PLC for 240Mbps High-Speed Power Line Communications
2012-02-22 09:08:00
SoC Architecture & Assembly
Semiconductor IP News Archive - Page 980 of 1948
AuthenTec Extends Content Protection Offerings with Solution Suite for HDCP
2012-02-22 09:05:00
SoC Architecture & Assembly
Altera Demonstrates First FPGAs to Interoperate with 100-Gbps Optical Module
2012-02-22 08:46:00
SoC Architecture & Assembly
Arasan Chip Systems Sees Rapid Market Growth for MIPI IP products
2012-02-22 08:42:00
Misc
Accellera Systems Initiative Announces IEEE 1666 SystemC Language Standard for Electronic System-Level Design Is Available for Download at No Charge
2012-02-22 01:37:00
EDA & Design Tools
Tensilica's Leadership in Mobile Audio/Voice and Baseband IP Cores Demonstrated at Mobile World Congress 2012
2012-02-22 01:11:00
Misc
Sidense 1T-OTP Helps Calibrate Aptina's Advanced Imaging Products
2012-02-21 15:38:00
Commercial Deals
Intel confirmed as foundry for second FPGA startup
2012-02-21 15:31:00
Analysis & Insight
Tabula Confirms Move to Intel's 22nm Process Featuring 3-D Tri-Gate Transistors
2012-02-21 15:17:00
SoC Architecture & Assembly
Cadence Expands Proven Ethernet IP Offering With 40/100 Gigabit Ethernet Solution
2012-02-21 14:11:00
IP Cores & Design
Cyclos Semiconductor Announces First Commercial Implementation of Resonant Clock Mesh Technology
2012-02-21 14:03:00
Commercial Deals
CEVA and Antcor Announce Low Power, Wi-Fi 802.11ac Reference Architecture for the New CEVA-XC4000 DSP Architecture Framework
2012-02-21 12:02:00
SoC Architecture & Assembly
CEVA Unveils the CEVA-XC4000 - A Low-Power DSP Architecture Framework for the Widest Array of Advanced Wireless Standards
2012-02-21 11:59:00
IP Cores & Design
Tensilica Lays the Foundation for Software Programmable LTE-Advanced User Equipment PHY (Layer 1) in Less than 200mW
2012-02-21 11:51:00
IP Cores & Design
Cortus announces Processor IP Roadmap for Embedded System on Chip (SoC) Applications
2012-02-21 11:33:00
IP Cores & Design
CEVA Introduces Low Power, Multi-Mode LTE-Advanced Reference Architecture for the New CEVA-XC4000 DSP Architecture Framework
2012-02-21 06:05:00
SoC Architecture & Assembly
MIPS Technologies and Intrinsic-ID Team to add Top-level Security to Mobile Platforms
2012-02-21 03:42:00
SoC Architecture & Assembly
First Tegra-Powered Smartphone Announced With NVIDIA's Icera Modem Technology
2012-02-21 02:50:00
SoC Architecture & Assembly
Magillem and Green Hills Software to build a bridge and help software teams debug with MULTI IDE based on accurate automatically updated IEEE1685 compliant hardware description
2012-02-21 01:31:00
EDA & Design Tools
Moortec Semiconductor Sign Representative Agreement with Red Shift Sales in Silicon Valley, US
2012-02-20 16:17:00
Strategic Partnerships