Hitachi Reduces Verification Turnaround Time for Mixed-Signal Chip with Cadence Virtuoso AMS Designer 2015-02-26 09:12:00 EDA & Design Tools
INSIDE Secure Introduces HCE Payment Security Updates at Mobile World Congress 2015 2015-02-26 07:42:00 SoC Architecture & Assembly
Arteris FlexNoC Helps Enable Texas Instruments Wireless Connectivity for the Internet of Things (IoT) 2015-02-25 17:15:00 Commercial Deals
Cadence Achieves First PCI Express 2.0 and PCI Express 3.0 Compliance for TSMC 16nm FinFET Plus Process 2015-02-25 17:12:00 IP Cores & Design
Blu Wireless to demonstrate HYDRA gigabit modem IP targeted at mmWave communication 2015-02-25 13:41:00 IP Cores & Design
Xilinx and BEEcube Announce Highly Scalable Prototyping Platform for 5G Massive MIMO Antenna Systems 2015-02-25 13:34:00 SoC Architecture & Assembly
CEVA Brings Human-Like Intelligent Vision Processing to Low-Power Embedded Systems 2015-02-25 13:21:00 IP Cores & Design
Nabto offers its "Internet of Things" Communication Platform on Cortus-based Systems-on-Chips 2015-02-25 12:54:00 SoC Architecture & Assembly
Kilopass to Demonstrate Ultra Low-Power, High-Performance Non-Volatile Memory IP at GSA Memory+ Conference in Tokyo 2015-02-25 07:18:00 Misc
Dream Chip Technologies and Chips&Media partner to provide Premium Ultra HD (4k) video experience 2015-02-25 07:11:00 Strategic Partnerships
Tronics Expands its Business Model to Mobile and Wearable Applications with the Licensing of its Combo Sensors Based on Disruptive Magelan and M&NEMS Technologies 2015-02-25 07:08:00 IP Cores & Design
Microsemi's Innovative TimeProvider 5000 System Supports Phase Synchronization Needed for LTE Advanced and Small Cell Deployments 2015-02-25 04:36:00 SoC Architecture & Assembly
Hillcrest Labs' Freespace Always-On Sensing Software Available on Cadence Tensilica DSP 2015-02-24 17:41:00 SoC Architecture & Assembly