Aims Technology releases Aims Himalia, NoC explorer tool to provide complete on-chip interconnect solutions 2015-05-06 17:47:00 EDA & Design Tools
Conexant AudioSmart Voice and Speech Processing Software Now Optimized for Cadence Tensilica HiFi DSPs 2015-05-06 17:15:00 SoC Architecture & Assembly
Credo First to Demonstrate 28G SerDes on 16FinFET Plus Technology 2015-05-06 09:41:00 IP Cores & Design
ARM, Applied Micro and Netzyn Collaborate on New NFV Platform to Reduce Operator Costs 2015-05-06 08:39:00 SoC Architecture & Assembly
ARM and Enea Enable Diverse Silicon Support for Efficient OPNFV 2015-05-06 08:33:00 SoC Architecture & Assembly
Defacto Announces a Unified Design Flow to Ensure Coherency Between RTL, UPF, IPXACT and SDC 2015-05-06 03:54:00 EDA & Design Tools
NXP and Qualcomm Collaborate to Accelerate Adoption of NFC and Security in Mobile, Wearable and Internet of Things Devices 2015-05-05 16:15:00 SoC Architecture & Assembly
Arasan Chip Systems Completes a Decade of Total Ethernet IP Solutions 2015-05-05 15:30:00 IP Cores & Design
Silicon Storage Technology and GLOBALFOUNDRIES Announce Qualification of Automotive Grade 55nm Embedded Flash Memory Technology 2015-05-05 15:18:00 Foundries & Process Nodes
M31 Announces Partnership with AST Aiming for Israel’s Semiconductor Industry 2015-05-05 13:45:00 Strategic Partnerships
Dolphin Integration enables to get the most competitive Power Management Network 2015-05-04 15:53:00 IP Cores & Design
First Quarter Semiconductor Sales Up 6 Percent Compared to Last Year 2015-05-04 15:14:00 Analysis & Insight
Xilinx Accelerates System Verification with Vivado Design Suite 2015.1 2015-05-04 13:35:00 SoC Architecture & Assembly