Cadence Tempus Timing Signoff Solution Surpasses 200 Tapeout Milestone Within Two Years of Product Inception 2016-01-11 10:59:00 EDA & Design Tools
Dolphin Integration joins the international Design & IP Partner Program of imec IC-link's 2016-01-11 10:02:00 Misc
NeuroSky Uses ARM Mobile Tech to Enable Secure Remote Patient Monitoring 2016-01-11 06:43:00 SoC Architecture & Assembly
Xilinx Demonstrates 16nm Heterogeneous Multi-Processing SoC Solutions for ADAS Applications at CAR-ELE Japan 2016 2016-01-11 02:07:00 Misc
DSP Group Unveils SparkPA, Highest RF Transmit Power CMOS Power Amplifier (PA) for 802.11ac Access Points Using TSMC Standard CMOS Process 2016-01-11 01:48:00 SoC Architecture & Assembly
Moortec Announces New PVT Controller - Complete PVT Sub-System Solution 2016-01-07 15:24:00 IP Cores & Design
Gartner Says Worldwide Semiconductor Revenue Declined 1.9 Percent in 2015 2016-01-07 15:14:00 Analysis & Insight
Annapurna Labs, an Amazon Company, Announces Availability of Home Network and Storage Platform-on-Chip and Subsystem Solutions 2016-01-07 08:02:00 SoC Architecture & Assembly
INSIDE Secure Collaborates with Microsoft to Address Hollywood Studios' Security Requirements for 4K/UHD and HDR Content 2016-01-07 07:36:00 Strategic Partnerships
INSIDE Secure DRM Fusion Adds Support for Google Widevine Modular DRM System 2016-01-07 06:50:00 SoC Architecture & Assembly
New PowerVR GPUs from Imagination combine advanced graphics with optimizations for vision and computational photography 2016-01-06 16:35:00 IP Cores & Design