Fraunhofer IIS and intoPIX announce joint licensing program for JPEG XS 2021-02-11 08:01:00 Strategic Partnerships
Lattice FPGAs with High I/O Density Bring Low Power Signal Bridging and Interface Management to Edge Devices 2021-02-11 07:57:00 SoC Architecture & Assembly
Arteris IP Adds Two Veteran Executives to its Board of Directors 2021-02-10 16:12:00 People & Leadership
QuickLogic Launches Qomu - an Open Source SoC Dev Kit That Fits in Your USB Port 2021-02-10 14:24:00 SoC Architecture & Assembly
Top Five Wafer Capacity Leaders Raise Share of Global Capacity to 54% 2021-02-10 08:42:00 Analysis & Insight
Tiempo Secure announces the availability of its Secure Element IP core on GF 22 FDX and TSMC 16 FFC 2021-02-10 08:32:00 IP Cores & Design
eTopus Technology Announces Innovative SerDes Technology for Data Center, Cloud, Edge, and 5G Base Stations 2021-02-10 06:50:00 IP Cores & Design
Gartner Says Apple and Samsung Extended Their Lead as Top Semiconductor Customers in 2020 2021-02-09 08:22:00 Analysis & Insight
Fraunhofer IPMS presents TSN IP core designs with low latency for automotive on-board networks 2021-02-09 08:16:00 Misc
Device Authority, EPS Global and Intrinsic ID Announce Strategic Partnership 2021-02-09 08:08:00 Strategic Partnerships
Palma Ceia SemiDesign Expands Asia Team, Names Bo Liu Senior Director of Engineering in China 2021-02-09 07:44:00 People & Leadership
Synopsys Receives Customers' Choice Award for Paper Presented at TSMC 2020 Open Innovation Platform Ecosystem Forum 2021-02-09 03:14:00 Misc
Renesas and Dialog Semiconductor to Join Forces to Advance Global Leadership in Embedded Solutions 2021-02-08 15:38:00 Strategic Partnerships
Global Unichip Corporation and Flex Logix Achieve First-Time Working Silicon on Joint ASIC Development Using EFLX Embedded FPGA (eFPGA) IP 2021-02-08 14:12:00 IP Cores & Design