CAES Wins Contracts for Development of Next-Generation, Octa-Core, user-selectable CPU for Space 2022-09-23 10:53:00 Commercial Deals
Vidatronic to Exhibit at Samsung Foundry Forum and SAFE™ Forum in San Jose in October 2022-09-22 16:55:00 Misc
Flex Logix Selects Semifore for Advanced Inference Chip Design 2022-09-22 16:55:00 EDA & Design Tools
Imec researchers at Ghent University and Nokia Bell Labs work to debut key building block for the deployment of 100G PON networks 2022-09-22 16:55:00 Misc
Siemens collaborates with UMC to develop 3D integrated circuit hybrid-bonding workflow 2022-09-22 16:54:00 EDA & Design Tools
Inuitive launches NU4100, expanding its Edge-AI Vision-on-Chip IC portfolio 2022-09-22 16:50:00 SoC Architecture & Assembly
CEVA Accelerates 5G Infrastructure Rollout with Industry's First Baseband Platform IP for 5G RAN ASICs 2022-09-21 13:15:00 IP Cores & Design
Perforce Joins the Global Semiconductor Alliance and Debuts IP Maturity Model 2022-09-21 12:43:00 Misc
IntelliProp First to Market with Memory Fabric Based on CXL; Driving Most Disruptive Technology to Hit Data Centers in Decades 2022-09-21 11:45:00 SoC Architecture & Assembly
CEO interview: Alphawave IP's Pialis on chiplets and custom silicon 2022-09-21 11:34:00 Analysis & Insight
QuickLogic Raises Approximately $3.2 Million with Strategic Investment by Institutional Investors 2022-09-21 07:47:00 Strategic Partnerships
Movellus Secures $23M in Series B Funding to Accelerate Growth 2022-09-20 15:18:00 Strategic Partnerships
Synopsys Unveils Industry's First Unified Emulation and Prototyping System Addressing Verification Requirements Across the Chip Development Cycle 2022-09-20 15:11:00 EDA & Design Tools
CAES' Quad-Core LEON4FT Processor Selected for European Next-Generation Star Sensors 2022-09-20 14:34:00 Commercial Deals