Tenstorrent Selects Samsung Foundry to Manufacture Next-Generation AI Chiplet
2023-10-05 09:24:00
SoC Architecture & Assembly
Semiconductor IP News Archive - Page 151 of 1948
ELES and proteanTecs Partner to Enhance Reliability Testing with Deep Data Analytics
2023-10-05 09:11:00
EDA & Design Tools
Marquee Semiconductor Joins Singapore Semiconductor Industry Association to Catalyze Development of Singaporean Hub
2023-10-05 08:45:00
Misc
Cadence Completes Acquisition of Intrinsix
2023-10-05 02:20:00
Strategic Partnerships
Intel Announces Intent to Operate Programmable Solutions Group (PSG) as Standalone Business
2023-10-04 08:27:00
Strategic Partnerships
EdgeCortix Closes $20 Million in Additional Funding Round
2023-10-04 06:28:00
Strategic Partnerships
CEA and Siemens collaborate on research to expand applications of Digital Twin for industry
2023-10-03 16:19:00
EDA & Design Tools
BrainChip Makes Second-Generation Akida Platform Available to Advance State of Edge AI Solutions
2023-10-03 13:42:00
IP Cores & Design
Tachyum Books Purchase Order to Build System with 25,000x ChatGPT4 Capacity and 25x Faster than Current Supercomputers
2023-10-03 13:38:00
SoC Architecture & Assembly
Semidynamics and SignatureIP create a fully tested RISC-V multi-core environment and CHI interconnect
2023-10-03 08:15:00
IP Cores & Design
Alphawave Semi Earns Great Place to Work® Certification™ for 2023-24
2023-10-02 16:34:00
Misc
Capgemini boosts its semiconductor capabilities in Europe with acquisition of HDL Design House
2023-09-28 16:53:00
Strategic Partnerships
M31 Announces Low-Power IP Solutions for TSMC's N12e Process
2023-09-28 16:47:00
IP Cores & Design
TSMC Announces Breakthrough Set to Redefine the Future of 3D IC
2023-09-28 16:46:00
Foundries & Process Nodes
Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC's Advanced 4nm RF FinFET Process
2023-09-28 16:46:00
EDA & Design Tools
Percepio Enables Trace Observability for All RTOS, Middleware and Silicon Vendor APIs
2023-09-28 16:46:00
SoC Architecture & Assembly
Intrinsic ID Becomes World's First IP Vendor with PSA Certified Level 3 Root of Trust Component
2023-09-28 16:46:00
IP Cores & Design
How the Worlds of Chiplets and Packaging Intertwine
2023-09-28 16:46:00
Analysis & Insight
China Gears Up for Chip Dumping, Ex-DoC Official Says
2023-09-28 16:46:00
Analysis & Insight
Microchip FPGAs Speed Intelligent Edge Designs and Reduce Development Cost and Risk with Tailored PolarFire® FPGA and SoC Solution Stacks
2023-09-28 16:46:00
SoC Architecture & Assembly