Keysight Introduces Chiplet PHY Designer for Simulating D2D to D2D PHY IP Supporting the UCIe™ Standard 2024-01-24 19:52:00 EDA & Design Tools
Phison Deploys Cadence Cerebrus AI-Driven Chip Optimization to Accelerate Product Development 2024-01-23 15:30:00 EDA & Design Tools
Infineon and GlobalFoundries extend long-term agreement with focus on automotive microcontrollers 2024-01-23 10:57:00 Foundries & Process Nodes
Menta exhibits at Chiplet Summit and presents its new scalable chiplet platform, MOSAICS-LP 2024-01-23 09:32:00 Misc
Revolutionizing ProAV Networks: intoPIX Unveils TicoXS FIP for Unmatched 4K & 8K AVoIP Excellence at ISE 2024 2024-01-23 08:58:00 SoC Architecture & Assembly
Renesas Extends Tender Offer for Proposed Acquisition of Sequans 2024-01-22 10:13:00 Strategic Partnerships
T2M Unveils ASIL B-Certified CAN and LIN IP Cores, Securing 11 Licenses in 2023 2024-01-22 01:01:00 Misc
Cadence Unveils New Palladium Z2 Apps with Industry's First 4-State Emulation and Mixed-Signal Modeling to Accelerate SoC Verification 2024-01-19 07:50:00 EDA & Design Tools
Brian Philofsky Joins Flex Logix as Senior Director of Solutions Architecture 2024-01-18 16:46:00 People & Leadership
ITRI and TSMC Collaborate on Advancing High-Speed Computing with SOT-MRAM 2024-01-18 16:46:00 Foundries & Process Nodes
YorChip, Inc. announces its first Chiplet for Edge AI applications with IP licensed from Semidynamics, the leader in RISC-V IP based in Barcelona 2024-01-17 15:30:00 Misc
OIF Unveils CEI-112G-XSR+-PAM4 Extended Extra Short Reach Implementation Agreement, Paving the Way for Advanced Interconnectivity 2024-01-17 15:25:00 Misc
POLYN Announces Agreement with SkyWater Technology to Produce its First Commercial Voice Processing Chip 2024-01-17 13:48:00 SoC Architecture & Assembly