UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI 2023-10-31 09:03:00 Foundries & Process Nodes
Renesas' New Ultra-High Performance MCUs are Industry's First Based on Arm Cortex-M85 Processor 2023-10-31 08:53:00 SoC Architecture & Assembly
Weebit Nano signs Tier-1 licensing agreement; on track to generate first IP revenues in 2023 2023-10-30 14:47:00 Strategic Partnerships
EnSilica to supply beamforming SatCom ICs to Germany's VITES to enable power- and cost-efficient flat panel terminals for NGSO-constellations 2023-10-30 14:26:00 Commercial Deals
Aniah simultaneously validates ISO9001 and ISO27001 certifications, reinforcing its commitment to Quality and Cybersecurity 2023-10-30 01:01:00 EDA & Design Tools
Weebit Nano's ReRAM IP Awarded "Embedded Solution Product of the Year" in the Electronic Industry Awards 2023-10-26 16:46:00 Misc
Synopsys Honored at TSMC 2023 OIP Ecosystem Forum with Multiple Partner of the Year Awards 2023-10-26 16:46:00 Misc
Global Silicon Wafer Shipment Growth to Bounce Back in 2024 After 2023 Decline, SEMI Reports 2023-10-26 16:46:00 Analysis & Insight
Rambus Boosts AI Performance with 9.6 Gbps HBM3 Memory Controller IP 2023-10-26 09:19:00 IP Cores & Design
MosChip Technologies announces its new Managing Director & CEO 2023-10-26 06:14:00 People & Leadership
AI Silicon IP Provider Expedera Opens R&D Office in Singapore 2023-10-26 02:52:00 Strategic Partnerships
NeuReality and Veriest Achieve Great Engineering Feat to Advance AI Chips for World's Largest Data Centers 2023-10-25 16:58:00 Misc
Cadence Expands Tensilica IP Portfolio with New HiFi and Vision DSPs for Pervasive Intelligence and Edge AI Inference 2023-10-25 06:13:00 IP Cores & Design