ARM gets serious in physical IP at 32 nm
2007-10-08 16:47:00
Analysis & Insight
Semiconductor IP News Archive - Page 1375 of 1971
Key ASIC and RedDot Wireless to Co-Operate in the Development of Advanced Wireless Solutions
2007-10-08 15:31:00
SoC Architecture & Assembly
Saifun to Operate as Wholly Owned Subsidiary and Drive Spansion's Technology Licensing Business
2007-10-08 15:00:00
Strategic Partnerships
MIPS Technologies Announces Preliminary Fiscal First Quarter Revenue Results
2007-10-08 14:51:00
Financials
SoC design's new normalPlatform push roils business models
2007-10-08 13:27:00
Analysis & Insight
TSMC Appoints Yeon-Gun Jung Head of TSMC Korea
2007-10-08 11:04:00
People & Leadership
Staccato Communications Achieves WiMedia Platform Certification and Secures Additional Funding
2007-10-08 07:52:00
SoC Architecture & Assembly
Faraday Monthly Sales Report -- September 2007
2007-10-05 14:55:00
Financials
Elpida Introduces The World's Fastest DRAM Based On The Rambus XDR Memory Architecture
2007-10-05 14:49:00
Commercial Deals
American Power Conversion (APC) to be Covered by Patent License
2007-10-04 20:45:00
Commercial Deals
ANYKA Licenses ARM Technology Solution For Mobile Multimedia Applications
2007-10-04 14:22:00
Commercial Deals
TRANGO Virtual Processors announces secure virtualization on ARM multicore platforms
2007-10-04 11:34:00
SoC Architecture & Assembly
NEC Electronics Introduces NaviEngine1 Multicore Platform for Car Navigation Systems
2007-10-04 10:47:00
SoC Architecture & Assembly
Analyst: Linux set to dominate in embedded systems
2007-10-04 01:15:00
SoC Architecture & Assembly
Industry Leaders to Collaborate on Linux Mobile Computing Platform
2007-10-03 20:58:00
SoC Architecture & Assembly
ARM Unveils Cortex-A9 Processors For Scalable Performance and Low-Power Designs
2007-10-03 20:52:00
IP Cores & Design
Atmel Licenses Hardware Video Decoder from Hantro
2007-10-03 15:42:00
Commercial Deals
Helion Vision Selects the LatticeXP2 FPGA for its Next Generation Camera Modules
2007-10-03 14:56:00
SoC Architecture & Assembly
Renesas Technology Starts Sample Shipments of SH-Mobile G3 System LSI Jointly Developed With NTT DoCoMo, Fujitsu, Mitsubishi Electric, Sharp, and Sony Ericsson for 3G Mobile Phone Handsets
2007-10-03 14:40:00
SoC Architecture & Assembly
Jasper Design Automation Announces JasperGold(R) Verification System v4.5 Featuring Liveness Property Support, Improved Modeling and Faster Engine Performance
2007-10-03 14:24:00
EDA & Design Tools