Dolphin Integration -- Announcement of the yearly Sales Turnover 06/07 2007-10-19 17:24:00 Financials
Silicon Interfaces announces the release of its IEEE 1394 uVC Verification IP using Cadence IPCM Universal Reuse Methodology (URM) 2007-10-19 16:53:00 Verification IP
Evatronix joins OCP-IP to provide designers with better design reusability and faster time-to-market 2007-10-19 16:29:00 Misc
Think Silicon introduces IPGenius: The first on-line parametrizable IP generation platform 2007-10-18 14:51:00 IP Cores & Design
STMicroelectronics Introduces Next-Generation Single-Chip Automotive Navigation Processor with Embedded GPS 2007-10-18 07:37:00 SoC Architecture & Assembly
EEMBC Launches OABench(TM) 2.0 Second-Generation Office Automation Benchmark Suite for Embedded Processors 2007-10-18 03:07:00 Misc
SMIC and Magma Announce Availability of Enhanced Reference Flow for SMIC's 90-Nanometer Low-Power Process 2007-10-18 02:28:00 Foundries & Process Nodes
Sigma Media Processor is Adopted by Samsung’s New Third Generation Blu-ray Player 2007-10-18 01:28:00 SoC Architecture & Assembly
Genesys Testware Adds Automated Batch-Mode Diagnosis and Characterization of Embedded Memories 2007-10-17 17:13:00 EDA & Design Tools
Rambus Introduces Memory Controller Interface Solution for Industry-standard DDR3 DRAM 2007-10-17 14:04:00 IP Cores & Design
Tower Semiconductor Begins Volume Production of ViTi's CMOS Image Sensors for Home Security and Surveillance Systems 2007-10-17 04:27:00 Foundries & Process Nodes
GDA Technologies Announces Collaboration With California Micro Devices to Develop CM5100 for Mobile Handset Designs 2007-10-16 21:48:00 Misc
LogicVision Announces Industry's Most Comprehensive On-Chip eDRAM Test and Repair Solution 2007-10-16 15:42:00 IP Cores & Design
Imagination Technologies Licenses Another POWERVR SGX graphics core to Texas Instruments 2007-10-16 15:01:00 Commercial Deals
Tensilica Ports MPEG-4 BSAC Decoder for Digital Multimedia Broadcasting (DMB) to HiFi 2 Audio Engine 2007-10-16 14:54:00 SoC Architecture & Assembly
Broadcom Leaps Ahead of the Competition with the World's First '3G Phone on a Chip' Solution 2007-10-16 08:13:00 SoC Architecture & Assembly