Incoras Solutions announces MediaDesigner, an Eclipse-based Design and Test Workbench for OpenMAX IL Development 2009-05-19 10:33:00 SoC Architecture & Assembly
T-RAM and GLOBALFOUNDRIES Enter into Joint Development Agreement for Application of T-RAM's Thyristor-RAM Embedded Memory to Advanced Technology Nodes 2009-05-19 08:41:00 Strategic Partnerships
Cadence and Virtutech Extend Metric-Driven Verification to Virtual Systems Development 2009-05-19 08:11:00 Misc
Cadence Speeds Systems Development with Automated Transaction-Level Verification 2009-05-19 08:05:00 EDA & Design Tools
Innovision and NXP announce joint NFC marketing and licensing agreement 2009-05-18 18:53:00 Strategic Partnerships
Altera Ships Arria II GX FPGAs: High-Performance, Low-Cost Transceiver FPGAs for 3-Gbps Applications 2009-05-18 16:35:00 SoC Architecture & Assembly
Hynix Semiconductor, LG Electronics, Samsung Electronics and Silicon Image Sign Long-Term Agreement to Create the Next-Generation Memory Interface Technology Specification 2009-05-18 14:50:00 Strategic Partnerships
PLDA Achieves IP Success with Cadence SuperSpeed USB (USB 3.0) Verification IP 2009-05-18 14:33:00 Commercial Deals
NEC Electronics Introduces World's First USB 3.0 Host Controller 2009-05-18 11:09:00 SoC Architecture & Assembly
CEVA and Aricent to Demonstrate LTE PHY Platform for Cellular Handsets 2009-05-18 09:12:00 IP Cores & Design
SpringSoft Introduces Structured Method for SystemVerilog Testbench Debug and Analysis 2009-05-18 07:49:00 EDA & Design Tools
NXP Semiconductors Accelerates Design Cycle using New Cadence Encounter Digital Implementation System for Industry’s First 45nm Digital TV Processor 2009-05-18 05:58:00 EDA & Design Tools
New patented solutions from Dolphin Integration for pop-up noise reduction 2009-05-15 18:11:00 EDA & Design Tools
SMIC Announces Availability of 65-nanometer Low Leakage Process IP Portfolio 2009-05-15 10:09:00 Foundries & Process Nodes