Accent Expands ASIC Operations and Opens Design Facility in China 2009-02-10 07:34:00 Strategic Partnerships
ARM Showcases Innovation in Mobile Technology at 2009 GSMA Mobile World Congress 2009-02-10 06:02:00 Misc
Tensilica Demonstrates Audio, Video and Next-Generation Baseband DSP at Mobile World Congress in Barcelona 2009-02-10 04:20:00 Misc
MoSys, Inc. Reports Fourth Quarter and Full Year 2008 Financial Results 2009-02-09 22:20:00 Financials
CoWare and Rambus Announce Unique ESL Architecture Design Environment for Rambus' XDR Memory Architecture 2009-02-09 15:48:00 Misc
TMC and Dolphin Integration enter in a partnership for microprocessor cores to enable better competitiveness in the highly price-sensitive smart-card market 2009-02-09 15:44:00 Commercial Deals
I&C Technology Selects Mixed-Signal IP from S3 for Mobile TV SoC 2009-02-09 11:17:00 Commercial Deals
Intelop delivers industry's first customizable/scalable multi-port Network Switch + 1G/100 MB EMAC + Motorola CPU interface Silicon IP for industrial automation applications 2009-02-09 09:59:00 IP Cores & Design
SiliconBlue Announces Volume Production Shipments of its iCE65 Ultra-Low Power FPGAs 2009-02-09 08:54:00 SoC Architecture & Assembly
IMEC reports low-cost low-power 60GHz solutions in digital 45nm CMOS 2009-02-09 08:27:00 IP Cores & Design
MIPI Alliance Delivers Seven Vital Mobile Device Interface Specifications in 2008 2009-02-09 07:38:00 Misc
Freescale Introduces 45-nm PowerQUICC III Processor with Low Power, High Performance and Optimal Flexibility 2009-02-09 07:30:00 SoC Architecture & Assembly
Toshiba Develops World's Highest-Bandwidth, Highest Density Non-Volatile RAM 2009-02-09 07:30:00 SoC Architecture & Assembly
SPIRIT's Audio Software Now Available on Freescale's Quad Core DSP chips 2009-02-06 17:16:00 SoC Architecture & Assembly