Mindspeed to Present Next Generation of 4G Base Station Technology 2010-08-24 04:31:00 SoC Architecture & Assembly
Winbond Adopts SpringSoft Laker Layout and Routing Systems for Design of High Performance, Low Power Memory Chips 2010-08-24 04:06:00 EDA & Design Tools
STARC, Calypto and Virage Logic Break New Ground With Industry's Lowest Power Design Flow 2010-08-24 02:15:00 EDA & Design Tools
OCP-IP Provides Virtual Platform Leveraging Advanced OCP SystemC TLM Modeling Kit 2010-08-23 17:09:00 EDA & Design Tools
Magma Announces Quartz iPOP Initiative -- Delivers "Improved Productivity, Operability and Performance" for Faster, Higher Capacity Physical Verification 2010-08-23 16:52:00 EDA & Design Tools
Advantech and NetLogic Microsystems Announce 40Gbps AdvancedTCA Platform 2010-08-23 15:11:00 SoC Architecture & Assembly
DapTechnology's 1394b FireLink Extended IP boosts download performance on Ampex MiniR700 Solid State Data Recorder 2010-08-23 14:54:00 Commercial Deals
Lantiq's New Wireless LAN Chips Set Benchmarks for Reach and Robustness 2010-08-23 07:00:00 SoC Architecture & Assembly
SiliconBlue Ships Highest Logic Capacity FPGA in 6x6 mm Footprint Package 2010-08-23 06:55:00 SoC Architecture & Assembly
Intilop announces acceptance of their TCP/IP offload engine silicon IP by a major financial institution 2010-08-23 06:45:00 Commercial Deals
Lantiq Announces Family of Gigabit Speed Gateway Processors with Industry Leading Performance, Flexibility to Support New Digital Home Services 2010-08-23 01:07:00 SoC Architecture & Assembly