Innovative Memory Architectures for AI
One of the biggest trends in the industry today is the shift towards AI computing at the edge. For many years the expectation was that the huge datacenters on the cloud would be the ones performing all the AI tasks, and the edge devices would only collect the raw data and send it to the cloud, potentially receiving the end directives after the analysis was done.
More recently, however, it has become more and more evident that this can’t work. While the learning task is a strong fit for the cloud, performing inference on the cloud is less optimal.
With the promise of lower latency, lower power and better security, we are seeing AI inference in a growing number of edge applications, from IoT and smart home devices all the way up to critical applications like automotive, medical, and aerospace and defense.
Since edge devices are often small, battery-powered, and resource-constrained, edge AI computing resources must be low-power, high-performance, and low-cost. This is a challenge considering power-hungry AI workloads, which must rely on the storage of large amounts of data in memory and the ability to quickly access it. Some models have millions of parameters (e.g., weights and biases), which must be continually read from memory for processing. This creates a fundamental challenge in terms of power consumption and latency in computing hardware.
Data movement is a key contributor to power consumption. Within chips, significant power is consumed while accessing the memory arrays in which the data is stored and while transferring the data over the on-chip interconnect. The memory access and speed of the interconnect also contribute to latency, which limits the speed of the AI computation. Speed and power both get significantly worse when the data needs to be moved between two separate chips.
To keep edge computing resources low-power and low-latency, hardware must be designed so that memory is as close as possible to the computing resources.
The continuous move to smaller process geometries has helped to keep power consumption to a minimum and has also reduced latency for AI tasks. But while computing resources continually scale to more advanced nodes, Flash memory hasn’t been able to keep pace. Because of this, it isn’t possible to integrate Flash and an AI inference engine in a single SoC at 28nm and below for edge AI.
To read the full article, click here
Related Semiconductor IP
- Over-Voltage Lockout (OVLO) IP
- Verification IP for Universal Chiplet Interconnect Express (UCIe) up to 3.0
- UCIe-S (Gen2) Compatible PHY for Standard Package (x16) in TSMC N3P, North/South Orientation
- DSP-Based 112G SerDes
- XTAL oscillator in TSMC-7nm
Related Blogs
- LPDDR6: A New Standard and Memory Choice for AI Data Center Applications
- The Memory Imperative for Next-Generation AI Accelerator SoCs
- The Silent Guardian of AI Compute - PUFrt Unifies Hardware Security and Memory Repair to Build the Trust Foundation for AI Factories
- Enabling Memory Choice for Modern AI Systems: Tenstorrent and Rambus Deliver Flexible, Power-Efficient Solutions
Latest Blogs
- M31 High-Speed and Long-Channel MIPI C/D-PHY Solution on TSMC N3P/N3C
- Understanding security certification and how analog IP can help
- Embedded Security explained: Secure boot for embedded systems
- World's First Standards-Compliant 112G PHY IP for Linear Optics: A Turning Point for AI Interconnects
- One Key for Every Door: How Aliro Extends the UWB Digital Key Beyond the Car