Audio/Voice DSP IP core: the next road to billion unit shipment
When mentioning CEVA DSP IP cores, the first reaction is to think about the complexes DSP functions used into wireless Modem Application like 3G and Long Term Evolution (LTE). Considering that CEVA market share is above 70% for these products, such a reaction makes sense. But did you knew that CEVA DSP IP cores are also empowering audio/voice devices, in wireless (handset, smartphones) applications requiring ultra low power consumption, as well as in consumer oriented (non wireless) applications, where the highest performance is key?
To read the full article, click here
Related Semiconductor IP
- Open RAN Platform for Base Station and Radio
- Scalable 5G modem platform
- Scalable Edge NPU IP for Generative AI
- AI SDK for Ceva-NeuPro NPUs
- High-accuracy Sensor Fusion
Related Blogs
- The Road to Innovation with Synopsys 224G PHY IP From Silicon to Scale: Synopsys 224G PHY Enables Next Gen Scaling Networks
- The Next-Generation UCIe IP Subsystem for Advanced Package Designs
- Adapting Foundation IP to Exceed 2 nm Power Efficiency in Next-Gen Hyperscale Compute Engines
- Oxford Digital Offers Small Audio DSP Core With Graphical Programming
Latest Blogs
- Beyond the Fab: Building Europe’s Next Generation of Semiconductor Champions
- AI Semiconductor Design at 3nm and 2nm: Silicon-Proven IP
- Samsung Foundry and Cadence Expand Infrastructure and Physical AI Solution
- Scale-Up Ethernet Ecosystem Ramps Up: Cadence ESUN Controller IP Available
- Advancing Europe’s Automotive Innovation Ecosystem: Arteris Continues Its Work in the RIGOLETTO Project