Audio/Voice DSP IP core: the next road to billion unit shipment
January 4, 2013
When mentioning CEVA DSP IP cores, the first reaction is to think about the complexes DSP functions used into wireless Modem Application like 3G and Long Term Evolution (LTE). Considering that CEVA market share is above 70% for these products, such a reaction makes sense. But did you knew that CEVA DSP IP cores are also empowering audio/voice devices, in wireless (handset, smartphones) applications requiring ultra low power consumption, as well as in consumer oriented (non wireless) applications, where the highest performance is key?
To read the full article, click here
Related Semiconductor IP
- Open RAN Platform for Base Station and Radio
- Scalable 5G modem platform
- AI SDK for Ceva-NeuPro NPUs
- High-accuracy Sensor Fusion
- Bluetooth Connectivity Platform
Related Blogs
- The Road to Innovation with Synopsys 224G PHY IP From Silicon to Scale: Synopsys 224G PHY Enables Next Gen Scaling Networks
- The Fastest Path to Scalable Photonic Systems: Using Proven IP for both PIC and EIC designs
- Adapting Foundation IP to Exceed 2 nm Power Efficiency in Next-Gen Hyperscale Compute Engines
- The Next Leap in Datacenter AI: Orchestrating Custom Accelerators with SiFive Intelligent Control Units (ACUs)
Latest Blogs
- Designing for What Comes Next in AI
- Secure boot on Efinix Titanium Ti60: Getting started with KiviBoot-Tiny
- How Long Does It Take to Port a New AI Model? Minutes Now, and Falling
- PCI Express Security and TEE Integration, Part 1 - Establishing Trust
- World Models at the Edge, in Real Time: V-JEPA 2.1 on the Quadric GPNPU