Audio/Voice DSP IP core: the next road to billion unit shipment
January 4, 2013
When mentioning CEVA DSP IP cores, the first reaction is to think about the complexes DSP functions used into wireless Modem Application like 3G and Long Term Evolution (LTE). Considering that CEVA market share is above 70% for these products, such a reaction makes sense. But did you knew that CEVA DSP IP cores are also empowering audio/voice devices, in wireless (handset, smartphones) applications requiring ultra low power consumption, as well as in consumer oriented (non wireless) applications, where the highest performance is key?
To read the full article, click here
Related Semiconductor IP
Related Blogs
- The Road to Innovation with Synopsys 224G PHY IP From Silicon to Scale: Synopsys 224G PHY Enables Next Gen Scaling Networks
- The Blind Spot of Semiconductor IP Sales
- The Next-Generation UCIe IP Subsystem for Advanced Package Designs
- Adapting Foundation IP to Exceed 2 nm Power Efficiency in Next-Gen Hyperscale Compute Engines
Latest Blogs
- Inside the SiFive Performance™ P570 Gen 3: High Performance Efficiency for Next-Generation Consumer and Commercial Applications
- What the steam engine can teach us about modern chip design
- Automotive silicon in the era of AI, functional safety, and cybersecurity
- JPEG XS Officially Joins GenICam, The Machine Vision Standard Managed By EMVA
- Beyond PCIe Compliance: Why Stress Testing Is Crucial for Edge AI Deployments