TSMC to Raise $9 Billion for Expansion Amid Shortages
By Alan Patterson, EETimes (February 11, 2021)
TAIPEI — Taiwan Semiconductor Manufacturing Co. (TSMC) said that it plans two sales of bonds that would raise about $9 billion to expand production, possibly helping to ease a critical shortage of silicon.
In a Feb. 9 board meeting, the world’s largest chip foundry approved the issuance of corporate bonds in Taiwan for as much as NT$120 billion (approximately $4.4 billion) and provided a guarantee to subsidiary TSMC Global to issue US dollar-denominated corporate bonds for up to $4.5 billion that would fund capacity expansion as well as pollution-prevention measures.
To read the full article, click here
Related Semiconductor IP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
Related News
- Chartered Begins Next Phase of Equipment Move-In at Fab 7 in Support of Planned Capacity Expansion for Leading-Edge Processes
- SiBEAM Invigorates CE and PC Industries with Launch of Products and Partnerships to Fuel WirelessHD Expansion
- GlobalFoundries hints at further expansion plans
- Assisting the Customer to Get the Certification of USB 3.0 Host Controller, Faraday Sets A Great Milestone for Its and USB 3.0's Market Expansion in the Industry
Latest News
- Imagination Technologies appoints Markus Mosen as Chief Executive Officer
- Barcelona Zettascale Lab advances European technological sovereignty as Cinco Ranch TC1 chip passes validation
- CoreHW Appoints Redtree as Pan-EMEA Sales Representative
- Imec inaugurates NanoIC pilot line, accelerating innovation in sub-2nm systems-on-chip
- Honda and Mythic Announce Joint Development of 100x Energy-Efficient Analog AI Chip for Next-Generation Vehicles