Stepmind details chips in support of Hiperlan2 and 4G
Stepmind details chips in support of Hiperlan2 and 4G
By Peter Clarke, Semiconductor Business News
February 17, 2003 (8:27 a.m. EST)
URL: http://www.eetimes.com/story/OEG20030217S0011
PARIS --- Stepmind SA, a fabless design house that specializes in wireless chips, has provided some details of a wireless LAN chipset capable of supporting both the IEEE802.11a and ETSI HiperLAN2 standards, and said it would introduce the first version, in mid 2003. “This total WLAN solution includes a WLAN baseband processor with its protocol software and a single-chip 5-GHz transceiver," said Andre Jolivet, business development manager and Stepmind founder, in a statement. “It achieves the highest integration, lowest component count and lowest BOM [bill of materials] on the market,” he added. The internal architecture of the baseband chip is designed to support integration with an 802.11b modem and with Stepmind's GSM/GPRS/EDGE solution to provide support for a fourth generation, mobile communications platform, the company said. The 5-GHz RF transceiver is a zero intermediate frequency device that includes the synthesizer and voltage-c ontrolled oscillators. The chip is capable of emitting up to +10-dBm in both the American and European 5-GHz WLAN bands without any external power amplifier, the company said. As part of its offering Stepmind plans to provide software protocol stacks for IEEE802.11a and ETSI HiperLAN2, with standard network and application interfaces, such as CardBus for network interface card (NIC) products and Ethernet for Access Points.
Related Semiconductor IP
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
Related News
- USPTO announces Semiconductor Technology Pilot Program in support of CHIPS for America Program
- Igniting Innovation: Siemens EDA launches Cre8Ventures in support of the EU Chips Act
- Xiphera Partners with Siemens Cre8Ventures to Strengthen Automotive Security and Support EU Chips Act Sovereignty Goals
- Amphion launches first dual-standard 5-GHz wireless-LAN baseband IP cores for 802.11a and hiperlan2
Latest News
- CAST Introduces MAC-SEC-MG IP Core for Secure 10G+ Ethernet SoC Designs
- Crypto Quantique and Attopsemi Unite PUF and I-fuse® OTP technology to Deliver Zero-Overhead Device Enrollment on FinFET Technology
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory