InterDigital Signs SII Mobile Communications to Worldwide Patent License Agreement
KING OF PRUSSIA, Pa.-- February 24, 2011 -- InterDigital, Inc. (NASDAQ: IDCC) today announced that its patent holding subsidiaries have previously entered into a worldwide, non-transferable, non-exclusive, royalty-bearing patent license agreement with SII Mobile Communications Inc., a subsidiary of Seiko Holdings Corporation, headquartered in Japan. The agreement covers the sale of SII's wireless products, including 2G and 3G Machine-to-Machine (M2M) modules and PC Cards.
"We are pleased to add SII Mobile Communications to our growing list of licensees," said Lawrence F. Shay, President of InterDigital's patent holding subsidiaries. "With the signing of this new customer, we continue the licensing momentum we have shown over the last eighteen months. Over that time frame, we entered into a dozen new agreements and amendments, adding to our solid base of customers paying recurring royalties and continuing our expansion into new market segments."
About InterDigital®
InterDigital develops fundamental wireless technologies that are at the core of mobile devices, networks, and services worldwide. We solve many of the industry's most critical and complex technical challenges, inventing solutions for more efficient broadband networks and a richer multimedia experience years ahead of market deployment. InterDigital has licenses and partnerships with many of the world's leading wireless companies.
InterDigital is a registered trademark of InterDigital, Inc.
For more information, visit: www.interdigital.com
Related Semiconductor IP
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
Related News
- Sharp licenses wireless IP from InterDigital
- Patriot Scientific Corporation Confirms Seiko Epson Agreement to Purchase MMP License
- Infineon and InterDigital expand cooperation; InterDigital Announces Availability of Complete Dual-Mode 2G/3G Wireless Modem Platform based on 2G GSM/ GPRS/EDGE Technology from Infineon
- PLDA and AGFA Graphics Sign Silica-Brokered Deal
Latest News
- Crypto Quantique and Attopsemi Unite PUF and I-fuse® OTP technology to Deliver Zero-Overhead Device Enrollment on FinFET Technology
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem