Sharp licenses wireless IP from InterDigital
Sharp licenses wireless IP from InterDigital
By Semiconductor Business News
September 4, 2001 (7:12 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010904S0084
KING OF PRUSSIA, Penn. -- InterDigital Communications Corp. here today announced that it has entered into a royalty-bearing patent license agreement with Japan's Sharp Corp. Under the terms, InterDigital will license its chip-level intellectual-property to Sharp. The agreement covers wireless handsets, modules and communications cards based on second- and third-generation wireless technologies. It also includes the CDMA, GSM, HDR, and GPRS standards.
Related Semiconductor IP
- USB 20Gbps Device Controller
- SM4 Cipher Engine
- Ultra-High-Speed Time-Interleaved 7-bit 64GSPS ADC on 3nm
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
Related News
- InterDigital and Sharp Corporation Expand Patent License Agreement to Include LTE Coverage
- Socionext Licenses Flex Logix's Embedded FPGA (eFPGA) for 5G Wireless Base Station Platform
- ListenAI Licenses Ceva-Waves Wi-Fi 6 IP, Bringing Seamless Wireless Connectivity to its Edge AI Portfolio
- Kyocera Licenses Quadric’s Chimera GPNPU AI Processor IP
Latest News
- GlobalFoundries and Egis Partner to Develop Next-Generation Smart Sensing Technology for Mobile and IoT Applications
- VeriSilicon Introduces FD-SOI Wireless IP Platform for Diverse IoT and Consumer Electronics Applications
- Arteris Selected by NanoXplore for Space Applications
- Siemens accelerates complex semiconductor design and test with Tessent IJTAG Pro
- Thalia and X-FAB Forge Strategic Partnership to Safeguard Supply and Accelerate IP Migration