Sharp licenses wireless IP from InterDigital
Sharp licenses wireless IP from InterDigital
By Semiconductor Business News
September 4, 2001 (7:12 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010904S0084
KING OF PRUSSIA, Penn. -- InterDigital Communications Corp. here today announced that it has entered into a royalty-bearing patent license agreement with Japan's Sharp Corp. Under the terms, InterDigital will license its chip-level intellectual-property to Sharp. The agreement covers wireless handsets, modules and communications cards based on second- and third-generation wireless technologies. It also includes the CDMA, GSM, HDR, and GPRS standards.
Related Semiconductor IP
- Multi-channel, multi-rate Ethernet aggregator - 10G to 400G AX (e.g., AI)
- Multi-channel, multi-rate Ethernet aggregator - 10G to 800G DX
- 200G/400G/800G Ethernet PCS/FEC
- 50G/100G MAC/PCS/FEC
- 25G/10G/SGMII/ 1000BASE-X PCS and MAC
Related News
- ListenAI Licenses Ceva-Waves Wi-Fi 6 IP, Bringing Seamless Wireless Connectivity to its Edge AI Portfolio
- InterDigital and Sharp Corporation Expand Patent License Agreement to Include LTE Coverage
- InPlay Technologies Licenses and Deploys CEVA's Bluetooth 5 Low Energy IP for Breakthrough SoC Targeting Wearable, Healthcare and Wireless IoT Markets
- Socionext Licenses Flex Logix's Embedded FPGA (eFPGA) for 5G Wireless Base Station Platform
Latest News
- How CXL 3.1 and PCIe 6.2 are Redefining Compute Efficiency
- Secure-IC at Computex 2025: Enabling Trust in AI, Chiplets, and Quantum-Ready Systems
- Automotive Industry Charts New Course with RISC-V
- Xiphera Partners with Siemens Cre8Ventures to Strengthen Automotive Security and Support EU Chips Act Sovereignty Goals
- NY CREATES and Fraunhofer Institute Announce Joint Development Agreement to Advance Memory Devices at the 300mm Wafer Scale