Sharp licenses wireless IP from InterDigital
Sharp licenses wireless IP from InterDigital
By Semiconductor Business News
September 4, 2001 (7:12 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010904S0084
KING OF PRUSSIA, Penn. -- InterDigital Communications Corp. here today announced that it has entered into a royalty-bearing patent license agreement with Japan's Sharp Corp. Under the terms, InterDigital will license its chip-level intellectual-property to Sharp. The agreement covers wireless handsets, modules and communications cards based on second- and third-generation wireless technologies. It also includes the CDMA, GSM, HDR, and GPRS standards.
Related Semiconductor IP
- Flash Memory LDPC Decoder IP Core
- SLM Signal Integrity Monitor
- All Digital Fractional-N RF Frequency Synthesizer PLL in GlobalFoundries 22FDX
- USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
- TSMC CLN5FF GUCIe LP Die-to-Die PHY
Related News
- ListenAI Licenses Ceva-Waves Wi-Fi 6 IP, Bringing Seamless Wireless Connectivity to its Edge AI Portfolio
- InterDigital and Sharp Corporation Expand Patent License Agreement to Include LTE Coverage
- InPlay Technologies Licenses and Deploys CEVA's Bluetooth 5 Low Energy IP for Breakthrough SoC Targeting Wearable, Healthcare and Wireless IoT Markets
- Socionext Licenses Flex Logix's Embedded FPGA (eFPGA) for 5G Wireless Base Station Platform
Latest News
- SEMIFIVE Files for Pre-IPO Review on KRX
- Innosilicon Scales LPDDR5X/5/4X/4 and DDR5/4 Combo IPs to 28nm and 22nm, Cementing Its Position as the ‘One Stop’ for Memory Interface Solutions
- Synopsys Completes Acquisition of Ansys
- Zephyr 4.0 Now Available for SCR RISC-V IP
- Lattice Semiconductor and Missing Link Electronics Become Partners to Accelerate FPGA Design Projects