Sharp licenses wireless IP from InterDigital
Sharp licenses wireless IP from InterDigital
By Semiconductor Business News
September 4, 2001 (7:12 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010904S0084
KING OF PRUSSIA, Penn. -- InterDigital Communications Corp. here today announced that it has entered into a royalty-bearing patent license agreement with Japan's Sharp Corp. Under the terms, InterDigital will license its chip-level intellectual-property to Sharp. The agreement covers wireless handsets, modules and communications cards based on second- and third-generation wireless technologies. It also includes the CDMA, GSM, HDR, and GPRS standards.
Related Semiconductor IP
- eUSB2V2.0 Controller + PHY IP
- I/O Library with LVDS in SkyWater 90nm
- 50G PON LDPC Encoder/Decoder
- UALink Controller
- RISC-V Debug & Trace IP
Related News
- InterDigital and Sharp Corporation Expand Patent License Agreement to Include LTE Coverage
- Socionext Licenses Flex Logix's Embedded FPGA (eFPGA) for 5G Wireless Base Station Platform
- ListenAI Licenses Ceva-Waves Wi-Fi 6 IP, Bringing Seamless Wireless Connectivity to its Edge AI Portfolio
- VeriSilicon Introduces FD-SOI Wireless IP Platform for Diverse IoT and Consumer Electronics Applications
Latest News
- Qualitas Semiconductor Secures Strategic IP Licensing Agreement for MIPI Solutions
- Chinese RISC-V Chipmaker SpacemiT Launches K3 AI CPU, Highlighting the Rise of Open-Source Hardware in Intelligent Computing
- Weebit Nano Q2 FY26 Quarterly Activities Report
- Arasan announces the immediate availability of the industries first xSPI NOR + eMMC NAND Combo PHY IP
- AMIQ EDA Gives AI Agents Access to Essential Design and Verification Data