GUC Launches Next - Generation 2.5D/3D APT Platform Leveraging TSMC’s Latest 3DFabric® and Advanced Process Technologies

SAN JOSE, California – September 24, 2025 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and reduce risk for high-performance, high-yield ASICs. The platform integrates TSMC’s latest 3DFabric® technologies and advanced process nodes, enable next-generation designs with a comprehensive solution that spans from silicon-proven IP to 2.5D/3D packaging.

The new platform builds on GUC’s first-generation 2.5D/3D APT platform introduced in 2022. Since then, GUC has closely collaborated with TSMC to incorporate major technological advancements of TSMC in both logic processes and 3DFabric technologies. TSMC’s evolution from FinFET-based N5/N3 nodes to next-generation nanosheet nodes—N2 and A16—has enabled unprecedented integration density and performance scaling. Simultaneously, TSMC’s 3DFabric innovations, including CoWoS®, TSMC-SoIC®, and System-on-Wafer (TSMC-SoWTM), allow for advanced 2.5D/3D integration of multiple dies across larger package substrates.

Industry standards have also evolved. The latest HBM4 memory interface doubles I/O to 2,048 pins, unlocking significantly higher bandwidth. Meanwhile, the UCIe™ die-to-die interface has gained industry-wide adoption, advancing from 16Gbps to 24Gbps and now 32Gbps—and beyond.

GUC Milestones and Technology Highlights

UCIe Die-to-Die IP: GUC offers UCIe-A 32G/36G IP in TSMC N3 and N5 processes, with a 64G version under development and scheduled for tape-out in late 2025. The UCIe-A IP in TSMC 2nm technology is also planned for 2026.

Integration with TSMC SoIC-X: GUC successfully taped out UCIe Face-Up IP in TSMC N5 using TSVs for bottom die applications—enabling vertical die stacking in future nodes.

HBM4 IP: GUC taped out its HBM4 PHY IP on TSMC N3P, achieving 12Gbps speeds. The IP supports CoWoS-L/R and SoW platforms, with porting to TSMC N2P underway for a 2026 tape-out.

GLink/UCIe-3D IP: Building on its GLink-3D 1.0 success, GUC now offers UCIe/GLink-3D 2.0 IP delivering 50 Tbps/mm² bandwidth, architecture proven via TSMC N2P. A customized version has already been taped out by a lead customer for an N3 over N5 ASIC.

Deep Collaboration with TSMC

GUC has long worked with TSMC closely to develop silicon-proven IP and platform technologies. This ongoing collaboration ensures alignment with TSMC’s latest process and 3DFabric packaging advances, enabling customers to reduce design risk while accelerating time-to-market.

“TSMC has been working closely with our Open Innovation Platform® (OIP) partners like GUC to develop IP solutions for our advanced process and 3DFabric technologies,” said Aveek Sarkar, Director of Ecosystem and Alliance Management Division at TSMC. “Our latest collaboration with GUC in enabling its 2.5D/3D platform will help customers accelerate product development cycles and deliver next-generation silicon using our advanced packaging and process technologies.”

“We were industry-leading with HBM3 PHY and Controller, and again with HBM4 in 2025,” said Aditya Raina, CMO of GUC. “Our UCIe IP has demonstrated unmatched 32Gbps speed and is now moving to 64Gbps era. Our Custom GLink-3D 2.0 IP has achieved 40 Tbps/mm² through a lead customer. These achievements mark the dawn of true 3D ASICs.”

GUC’s next-generation APT platform combines cutting-edge IP, TSMC-certified design flows, and high-volume production experience to enable rapid, low-risk development of next-generation AI, HPC, and networking chips.

To learn more about GUC’s solutions, please contact GUC sales representative via email (https://www.guc-asic.com/en/about/locations?).

About GUC

Global Unichip Corp. (GUC), headquartered in Hsinchu, Taiwan, is a leading provider of advanced ASIC design and turn-key manufacturing services. GUC delivers full-stack solutions covering spec-in design, SoC integration, physical implementation, and advanced packaging. In strategic partnership with TSMC—its largest shareholder and exclusive foundry supplier—GUC leverages cutting-edge process and packaging technologies to deliver PPA-optimized ASIC solutions with superior quality and yield. GUC is publicly listed on the Taiwan Stock Exchange under ticker 3443, with a global presence across North America, Mainland China, Europe, Korea, Japan, and Vietnam.

For more information, please visit: www.guc-asic.com