eSilicon's eFlexCAM cores enable 725 million searches per second
IP offering delivers high-performance ASIC building blocks
SUNNYVALE, California – October 28, 2010 - eSilicon Corporation, the largest independent semiconductor Value Chain Producer (VCP), today announced the availability of production-proven eFlexcontent-addressable memory (CAM) cores and eFlexCAMcompilers, developed to support applications such as network switches, routers, gateways, firewalls and web servers.
CAMs provide ultra-high-speed table-lookup functionality that is critical for high-speed searches required for packet processing in communications applications. While binary CAMs (BCAMs) are useful in applications that require matching an exact pattern in the table, ternary CAMs (TCAMs) are useful in applications that require multi-dimensional matching with wildcards.
To address this important market need, eSilicon offers various CAM cores and CAM compilers. Currently available eFlexCAM cores include silicon-proven BCAMs and TCAMs on process nodes ranging from 180nm through 40nm. Also available is an eFlexCAM front-end kit for customers to start implementing their 28nm designs.
Customers can also use eFlexCAM compilers to optimize the CAM cores for their specific needs by selecting only features needed for their specific applications. Priority encoding, redundancy and at-speed BIST features are options that are always available with the CAM cores.
“It’s exciting to be able to exceed customer expectations through our established, well-received products and services, combined with highly specialized yet flexible IP memory cores that deliver the high-performance needed in our customers’ end products,” said Duytan Tran, president of SDS and vice president of the SDS business unit at eSilicon.
“Through our product and services offering from our SDS business unit, eSilicon now delivers more value to our OEM and FSC customers by enabling them to implement even higher-performance ASICs/ASSPs than were possible before,” said Patrick Soheili, vice president of marketing and business development at eSilicon.
Please contact us at sales@esilicon.com to learn more about how eSilicon can support your CAM IP and/or ASIC/ASSP needs.
About Value Chain Producer
A Value Chain Producer (VCP) is a company that collaborates with foundries, IP and service providers, EDA suppliers, package, assembly and test operations in designing and producing chips for fabless IC, IDM and OEM companies. VCPs optimize the economics of customer value chains and enable customers to focus on their product differentiation and market growth. A VCP earns revenue by shipping packaged, tested products with the customers’ logo. The term was created by eSilicon and was adopted by the Global Semiconductor Alliance (GSA) as a new category in October 2009.
About eSilicon
eSilicon, the largest independent semiconductor Value Chain Producer (VCP), provides a comprehensive suite of design, productization and manufacturing services, enabling a flexible, low-cost, lower-risk path to volume chip production. The company delivers application-specific integrated circuits (ASICs) to system original equipment manufacturers (OEMs) and fabless semiconductor companies (FSCs) who serve a wide variety of markets including the consumer, computer, communications and industrial segments. eSilicon — Enabling Your Silicon Success™. For more information, please visit www.esilicon.com.
Related Semiconductor IP
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
Related News
- sureCore announces low power memory compiler for 16nm FinFET
- JEDEC Expands CAMM Standardization to include Two Key Memory Technologies
- Numem Announces Series A Funding Led by Cambium Capital to Propel Memory Solutions for AI and IoT
- JEDEC Publishes New CAMM2 Memory Module Standard
Latest News
- CAST Introduces MAC-SEC-MG IP Core for Secure 10G+ Ethernet SoC Designs
- Crypto Quantique and Attopsemi Unite PUF and I-fuse® OTP technology to Deliver Zero-Overhead Device Enrollment on FinFET Technology
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory