AI Takes Over Linley Fall Processor Conference
By Kevin Krewell,
EEtimes (October 29, 2019)
Silicon Valley has more than its share of technical conferences, more so than you could possibly attend in the year. And even the conferences you do attend have multiple tracks, making it difficult to catch all the presentations. With that said, there are certain conferences that stand out every year for new chip announcements, including Hot Chips, the newly formed AI Hardware Summit, and the Linley Processor Conferences. The latter two conferences have sponsors present, so the content can vary, but The Linley Group is good at keeping the content technical and relevant.
To read the full article, click here
Related Semiconductor IP
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
Related News
- Linley Spring Processor Conference 2019: eSilicon to demonstrate 7nm DSP SerDes over a 5-meter cable assembly and present on IP platforms
- SiFive To Introduce New RISC-V Processor Architecture and RISC-V PC at Linley Fall Virtual Processor Conference
- Think Silicon to introduce a new Inference Micro GPU Architecture based on RISC-V at Linley Fall Virtual Processor Conference
- AuthenTec to Exhibit and Speak at Linley Tech Processor Conference
Latest News
- CAST Introduces MAC-SEC-MG IP Core for Secure 10G+ Ethernet SoC Designs
- Crypto Quantique and Attopsemi Unite PUF and I-fuse® OTP technology to Deliver Zero-Overhead Device Enrollment on FinFET Technology
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory