Tensilica Baseband DSPs and Dataplane Processors (DPUs) Power LTE/HSPA/3G Multimode Modem IC from NTT DOCOMO, Fujitsu, NEC, and Panasonic Consortium 2012-02-27 01:13:00 Commercial Deals
Xamarin Adding Support for MIPS Architecture to Popular Mono for Android Application Development Platform 2012-02-27 01:05:00 SoC Architecture & Assembly
Arkamys Audio Enhancement Software and Services Being Ported To Tensilica's HiFi Audio DSPs 2012-02-24 11:21:00 SoC Architecture & Assembly
Renesas Mobile Partners with NVIDIA to Deliver Next-Generation LTE Ultraphones 2012-02-24 11:17:00 SoC Architecture & Assembly
North American Semiconductor Equipment Industry Posts January 2012 Book-to-Bill Ratio of 0.95 2012-02-24 11:10:00 Analysis & Insight
First 28nm ARM Cortex-A9 Processor Optimization Pack now Available for GLOBALFOUNDRIES 28nm-SLP HKMG Process 2012-02-23 17:37:00 IP Cores & Design
Movea Launches Industry's First Motion Processing IP Cores designed for mobile devices 2012-02-23 14:32:00 IP Cores & Design
MediaTek and ARM Extend Relationship with Access Agreement for a Broad Range of the Latest ARM IP 2012-02-23 14:15:00 Commercial Deals
Chips&Media shows Next Generation of Video Processing Technologies at MWC 2012 2012-02-23 10:05:00 Misc
InterDigital and Sierra Wireless Expand Worldwide Patent License Agreement to Cover 4G Standards 2012-02-23 07:47:00 Strategic Partnerships
Imec and Renesas Electronics report record ADC for next-generation high-bandwidth wireless receivers 2012-02-23 07:43:00 IP Cores & Design
VeriSilicon Releases New Generation of Hantro Video IP Products to Promote WebM and WebRTC 2012-02-23 07:38:00 IP Cores & Design
Sensory and Tensilica Partner to Offer Complete Speech Recognition Subsystem 2012-02-23 07:23:00 SoC Architecture & Assembly
Altair Semiconductor to Bring its Leading LTE Chipset to MIPS-Based Android 4.0 "Ice Cream Sandwich" Tablets from Ingenic 2012-02-22 15:24:00 SoC Architecture & Assembly