Constellations Educational Webinar Series Brings Together Leading Companies to Inform Customers
2013-02-14 01:59:00
Misc
Semiconductor IP News Archive - Page 892 of 1947
Why we need an imaging IP core
2013-02-13 15:27:00
Analysis & Insight
Tensilica and Acoustic Technologies Extend Partnership to Deliver Complete Wideband HD Voice Processing Solution for Smartphones, Tablets and Other Mobile Computing Devices
2013-02-13 14:56:00
SoC Architecture & Assembly
CEVA to Showcase Industry-Leading Platform IP for Communications, Vision, Imaging, Audio and Voice at Mobile World Congress 2013
2013-02-13 13:08:00
Misc
Cadence Elects Young K. Sohn to Board of Directors
2013-02-13 06:30:00
People & Leadership
Forte Design Systems Becomes First High-Level Synthesis Software Provider to Support IEEE 1666-2011 SystemC
2013-02-12 15:22:00
EDA & Design Tools
Tensilica vs. Ceva in imaging/vision IP core battle
2013-02-12 14:00:00
Analysis & Insight
Xilinx Accelerates Design Productivity for High Volume Applications
2013-02-12 13:08:00
SoC Architecture & Assembly
Tensilica Unveils IVP - A New Imaging/Video DSP IP Core for Mobile Handsets, DTV, Automotive and Computer Vision Applications
2013-02-12 08:21:00
IP Cores & Design
Morpho and Tensilica Partner for Image Processing Solutions for Mobile Devices
2013-02-12 08:12:00
SoC Architecture & Assembly
Actions Semiconductor Licenses Arteris FlexNoC Interconnect IP for Multimedia Application Processors
2013-02-12 08:06:00
Commercial Deals
Silicon Wafer Revenues Decline in 2012
2013-02-12 07:50:00
Analysis & Insight
Almalence Ports Optimized Image Processing Software onto Tensilica's New IVP Imaging/Video DSP
2013-02-12 07:17:00
SoC Architecture & Assembly
Dream Chip and Tensilica Partner for Imaging/Video Development on the New IVP DSP
2013-02-12 06:19:00
SoC Architecture & Assembly
Irida Labs and Tensilica Partner for Computer Vision Applications on Tensilica's New IVP Imaging/Video DSP
2013-02-12 06:14:00
SoC Architecture & Assembly
Nujira releases new 16-band ET RF front-end for global LTE handsets
2013-02-11 16:19:00
SoC Architecture & Assembly
Synopsys Signs Multiyear Collaboration Agreement with ARM for Early Software Development for ARMv8 Processors
2013-02-11 15:11:00
SoC Architecture & Assembly
Tela Innovations, Inc. Files Complaint at the U.S. International Trade Commission for Unfair Trade Practices Stemming from Patent Infringement
2013-02-11 14:32:00
Legal & IP Strategy
Reflex CES Enters Mainstream FPGA-Prototyping Market; Offers 25-Million Gates or More ASIC Prototyping Platform With Partitioning Software
2013-02-11 13:11:00
Misc
Mobile and Cloud Computing Spur Tripling of Micro Server Shipments This Year
2013-02-11 08:46:00
Analysis & Insight