Achronix Now Shipping 22nm Speedster22i FPGAs to Customers 2013-02-20 17:27:00 SoC Architecture & Assembly
Xilinx Launches Fully Adaptive Gbps Class Point-to-Point Microwave Modem IP for Backhaul Applications 2013-02-20 16:17:00 IP Cores & Design
Imagination achieves OpenGL ES 3.0 conformance for PowerVR Series6 cores 2013-02-20 13:34:00 IP Cores & Design
Elliptic Technologies to Exhibit Embedded Silicon Security Solutions Devoted to Content Protection and Networking Applications at RSA Conference 2013 2013-02-20 12:36:00 Misc
Reflex CES Demonstrates SoC FPGA-Based System-on-Module at Embedded World 2013; Highlights Prototyping Platform, Recorders, Customizable Rugged Systems 2013-02-20 08:18:00 Misc
Five IC Suppliers to Hold One-Third of 300mm Wafer Capacity in 2013 2013-02-20 08:12:00 Analysis & Insight
GLOBALFOUNDRIES Offers Enhanced 55nm CMOS Logic Process with ARM Next-Generation Memory and Logic IP Support for Low Voltage 2013-02-20 07:39:00 Foundries & Process Nodes
Tensilica to Demonstrate Fujitsu Smartphone that Uses Multiple Tensilica DPUs Including ConnX BBE DSP and HiFi Audio/Voice at Mobile World Congress in Barcelona 2013-02-20 01:04:00 Misc
ARM and STMicroelectronics Join with Mathworks to Enable Code Generation, Debug and Modelling For STM32 Microcontrollers 2013-02-19 16:41:00 SoC Architecture & Assembly
Tilera Announces TILE-Gx72, the World's Highest-Performance and Highest-Efficiency Manycore Processor 2013-02-19 16:21:00 SoC Architecture & Assembly
LSI Introduces Axxia 5500 Communication Processors with ARM Technology for High-Performance, Power-Efficient Networks 2013-02-19 16:00:00 SoC Architecture & Assembly
CEVA and Mindspeed Extend Relationship to Address LTE-Advanced Small Cells 2013-02-19 13:13:00 Commercial Deals
CEVA Introduces MUST Multi-core System Technology, Adds Vector Floating-point Capabilities for CEVA-XC DSP Architecture Framework 2013-02-19 12:08:00 IP Cores & Design
CAST Adds Multicast and AXI to UDP/IP Core for Streaming Media Systems 2013-02-19 11:34:00 IP Cores & Design
AnSem announces the availability of an Analog Front End that makes Power Line Communication for smart grids more reliable 2013-02-19 09:50:00 SoC Architecture & Assembly
New mimoOn Library for Tensilica's Baseband DSP IP Cores Speeds Up LTE and LTE-Advanced Chip Designs 2013-02-19 07:33:00 SoC Architecture & Assembly
Sensory's New TrulyHandsfree 3.0 Speaker Verification and Speaker Identification Optimized Port Available on Tensilica HiFi Audio/Voice DSPs 2013-02-19 07:27:00 SoC Architecture & Assembly