Accent Extends Its Market Leading Position In ZigBee Solutions With ZigBee IP and SEP 2.0 2013-01-30 10:17:00 SoC Architecture & Assembly
Kilopass NVM IP Achieves JEDEC Qualification on High-Demand SMIC 65/55/40nm Processes 2013-01-30 09:36:00 IP Cores & Design
Real Intent Unveils Major Performance Enhancements in Ascent IIV and Ascent XV Tools for Early Functional Verification of Digital Designs 2013-01-30 01:02:00 EDA & Design Tools
MegaChips Licenses Arteris FlexNoC Fabric IP for Next-Generation Imaging SoCs 2013-01-29 17:52:00 Commercial Deals
Synopsys Announces Energy-Efficient 28-nm PCI Express 3.0 PHY with Support for 10GBASE-KR 2013-01-29 15:13:00 IP Cores & Design
New 32-bit BA25 Application Processor Adds More Performance to Royalty-Free BA2x Family 2013-01-29 14:00:00 IP Cores & Design
STATS ChipPAC and UMC Unveil World's First 3D IC Developed under an Open Ecosystem Model 2013-01-29 13:53:00 Foundries & Process Nodes
Freescale Semiconductor partners with IAR Systems to reach new performance high 2013-01-29 01:26:00 SoC Architecture & Assembly
The Linley Group Releases First Report Exclusively Focused on Wireless Modem Silicon 2013-01-28 17:34:00 Analysis & Insight
China's IC Market Growth Continues to Outpace Its IC Manufacturing 2013-01-28 16:55:00 Analysis & Insight
Rambus Introduces R+ Enhanced Standard Memory and Interface Solutions 2013-01-28 15:41:00 IP Cores & Design
SENSIO announces its first SENSIO Autodetect integration deal with major semiconductor manufacturer 2013-01-28 15:31:00 Commercial Deals
JDSU Adopts Altera Stratix V GT FPGA for Production of Next-Generation Optical Testers 2013-01-28 15:27:00 SoC Architecture & Assembly