Altera Accelerates High-capacity FPGA Design with Quartus Prime Pro Design Software
2016-05-09 14:22:00
SoC Architecture & Assembly
Semiconductor IP News Archive - Page 635 of 1946
UMC Reports Sales for April 2016
2016-05-09 10:54:00
Financials
EnSilica launches eSi-ECDSA cryptographic IP for standards-compliant automotive Car2x communications
2016-05-09 10:45:00
IP Cores & Design
RFEL adds Wideband capability to its award-winning ChannelCore Flex advanced channeliser IP core
2016-05-09 10:39:00
IP Cores & Design
Faraday Monthly Consolidated Sales Report - April 2016
2016-05-06 15:18:00
Financials
GUC Monthly Sales Report - April 2016
2016-05-06 13:48:00
Financials
OmniPHY Named One of 2016 20 Most Promising Semiconductor Companies by SiliconIndia
2016-05-06 09:57:00
Misc
Faraday Reduces Packaging Design Time by 60 Percent Using Cadence OrbitIO Interconnect Designer and SiP Layout
2016-05-04 17:21:00
EDA & Design Tools
Texas Instruments Leads Industrial Semiconductor Vendor Share Ranking in 2015; Market Rises to $40.7 billion
2016-05-04 16:44:00
Analysis & Insight
eASIC Joins the OpenPOWER Foundation to Offer Custom-designed Accelerator Chips
2016-05-04 16:32:00
Misc
Creonic Participates in International SENDATE-TANDEM Research Project
2016-05-04 16:28:00
Misc
CMOS Image Sensors Expected To Set Record-High Sales for Another Five Years
2016-05-04 11:32:00
Analysis & Insight
Faraday Showcases Virtual Platform Solution and 28nm IP at ChipEx 2016
2016-05-04 07:04:00
Misc
High Performance HEVC decoder IP released by Chips&Media
2016-05-03 17:04:00
IP Cores & Design
IEEE Releases the Accellera SystemC AMS Standard as IEEE 1666.1-2016
2016-05-03 16:04:00
Misc
NetSpeed Systems expands presence in Taiwan through partnership with Maojet Technology
2016-05-03 15:51:00
Strategic Partnerships
Next-generation multi-platform video analytics SoC results from collaboration between Imagination and ELVEES
2016-05-03 15:22:00
SoC Architecture & Assembly
Global Semiconductor Sales Increase Slightly in March
2016-05-03 14:55:00
Analysis & Insight
Sonics Develops Industry's First Energy Processing Unit Based on the ICE-Grain Power Architecture
2016-05-03 10:55:00
IP Cores & Design
Cadence Announces New Tensilica Vision P6 DSP Targeting Embedded Neural Network Applications
2016-05-03 10:52:00
IP Cores & Design