Overview
The Synopsys SuperSpeed 3.1 USB IP solution is based on the USB 3.0 specification from the USB Implementer Forum. The comprehensive USB 3.1 IP offering consists of Host, Device, and Dual-Role Device controllers, PHYs with and without support for the USB Type-C™ connectivity specification and DisplayPort 1.3 support, verification IP, IP Prototyping Kits, and IP software development kits. These elements enable quick development of advanced chip designs incorporating the 10 Gbps SuperSpeed USB standard.
The Synopsys USB 3.1 IP is targeted for integration into SoCs for media storage, creation, and playback devices, requiring faster bandwidth
between PCs and portable electronic devices. Optimized for low power, the Synopsys USB 3.1 Controller and PHY IP allow designers to maximize power efficiency for extended battery life. The Synopsys USB 3.1 IP enables the fastest SuperSpeed USB data transfer speeds while lowering overall power consumption.
As the leading supplier of USB IP, Synopsys provides designers with a high- performance, low-power, and area-efficient IP solution, for cost-effective integration into system-on-chip designs. Synopsys’ expertise in developing and supporting USB enables us to build a low risk, high quality SuperSpeed USB IP solution.
Learn more about USB IP core
Synopsys extended its long-standing collaboration with Infineon to deliver a Synopsys Virtualizer™ Development Kit (VDK) supporting Infineon’s AURIX™ RC1 microcontroller (MCU) family. The VDK equips automotive engineering teams with a virtual prototype of the AURIX™ RC1 MCU, Infineon’s new scalable computing platform for software-defined vehicle (SDV) and Physical AI applications.
Explore three agentic AI adoption paths that help chip design teams combine flexible AI stacks with trusted, physics-based engineering tools.
Supporting the European Chips Act, startups and research teams will gain access to Synopsys chip design solutions to advance Europe’s strategic goals in areas such as AI and high-performance computing (HPC)
Recognition highlights leadership in agentic AI design, advanced-node enablement, co-packaged optics, and silicon-proven IP for next-generation AI systems
Leading portfolio of engineering solutions positions Synopsys to capitalize on the continued expansion of digital and physical AI and the AI-driven transformation of engineering.
The companies signed an expansive, multi-year agreement to jointly develop GPT-Synopsys, a specialized model, optimized to use Synopsys EDA tools to perform semiconductor design workflows.