Overview
The proliferation and expansion of connected devices, connectivity infrastructure, cloud computing, and artificial intelligence is driving for increased need of high-grade security that keeps up with the hyper-connected and hyper-speed technology requirements to protect the significant increase in volume of confidential information and critical data.
AES with Galois/Counter Mode (AES-GCM) is a symmetric cryptographic algorithm that provides a scalable authenticated encryption and data integrity and is used in many applications and security protocols.
The Synopsys Ultra High Performance AES-GCM/CTR IP core implements the AES-GCM/CTR algorithm as specified in the National Institute of Standards and Technology (NIST) Special Publication 800-38D, “Recommendation for Block Cipher Modes of Operation: Galois/Counter Mode (GCM) and GMAC” to achieve terabit performance required for supercomputing applications. It uses the Advanced Encryption Standard (AES) algorithm in counter mode (CTR), and
a high-performance MAC algorithm based on Galois Field multiplication with CTR mode encryption, which can be pipelined for high-throughput operations.
Learn more about Symmetric Crypto IP core
Recognition highlights leadership in agentic AI design, advanced-node enablement, co-packaged optics, and silicon-proven IP for next-generation AI systems
Leading portfolio of engineering solutions positions Synopsys to capitalize on the continued expansion of digital and physical AI and the AI-driven transformation of engineering.
The companies signed an expansive, multi-year agreement to jointly develop GPT-Synopsys, a specialized model, optimized to use Synopsys EDA tools to perform semiconductor design workflows.
The multi-year agreement marks the expansion of Synopsys' silicon IP business to serve increasing demand for application-optimized IP with Amazon as its lead customer.
Open and Secure Synopsys Autopilot Platform Accelerates Engineering Productivity, Improves Design Quality, and Achieves Faster Closure Across Silicon to Systems
New collaborations span A14 design enablement, AI-assisted engineering workflows, CoWoS® support for multi-die designs, and unified multiphysics signoff