Overview
TileLink is a chip-scale connection standard that enables many masters to have synchronised memory mapped access to memory and other slave devices. TileLink is intended for use in a System On-Chip (SoC) to connect general-purpose multiprocessors, co-processors, accelerators, DMA engines, and simple or complicated devices, utilising a fast, scalable interconnect that provides both low latency and high-throughput transfers.
Learn more about Protocol Bridge IP core
IDS-AI is the industry’s first agentic AI framework built specifically for semiconductor development. It understands your design functional specification, your control and status registers (CSRs), your programming sequences, your system-on-chip (SoC) hierarchy, and your block interconnections.
This post discusses the network-on-chip (NoC) approach and explains how Agnisys can help you generate NoCs automatically for your designs.
Generate scalable NoC IPs with IDS-NoC™ for efficient data transfer, distributed routing, and high-performance SoC communication.
Agnisys will showcase IDS-AI™, IDS-NoC™, and Advance DFT Automation at DAC 2026 to accelerate chip design, improve quality, and speed SoC development.
Learn how automated RTL, UVM testbench, and validation code generation helps DV teams reduce verification errors and accelerate chip verification.
Modern System-on-Chip (SoC) designs are becoming increasingly complex as they integrate multiple processors, accelerators, memory subsystems, and peripherals. Ensuring efficient communication between these components requires a robust set of interface IPs, interconnects, and protocol bridges. However, designing and integrating these components manually can significantly increase development time, integration challenges, late‑stage bugs, and pressure on already‑stretched engineering teams.
