Vendor: Renesas Category: MIPI PHY

MIPI D-PHY Transmitter/Receiver for TSMC 22nm ULL

The MIPI® D-PHY Transmitter/Receiver is useful 2 Data Lanes transmitter/receiver hard macro for DSISM/CSI-2® of TSMC 22nm ULL process.

PHY MIPI D-PHY TSMC 22nm ULL Available on request View all specifications

Overview

The Renesas MIPI® D-PHY Transmitter/Receiver is useful 2 Data Lanes transmitter/receiver hard macro for DSISM/CSI-2® of TSMC 22nm ULL process.

Key features

  • Renesas MIPI D-PHYTransmitter/Receiver can be used for analog Transmitter/Receiver of following interface .
    • MIPI alliance Specification for D-PHY Version 2.1 15 December 2016.
    • MIPI alliance Specification for DSI(Display Serial Interface).
    • MIPI alliance Specification for CSI-2(Camera Serial Interface 2).
  • Technology is TSMC 22nm ULL 1p9M.
  • Supply voltage can be applied 1.1V for core voltage, 1.8V and 3.3V for IO voltage.
  • Maximum data rate of each channel is 1.2Gbps at High-speed mode.

Block Diagram

Silicon Options

Foundry Node Process Maturity
TSMC 22nm ULL Available on request

Specifications

Identity

Part Number
MIPI D-PHY Transmitter/Receiver - TSMC 22nm ULL
Vendor
Renesas
Type
Silicon IP
Controller / PHY
PHY

Standards & Interfaces

MIPI PHY
MIPI D-PHY

Files

Note: some files may require an NDA depending on provider policy.

Provider

HQ: Japan

Learn more about MIPI PHY IP core

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Frequently asked questions about MIPI PHY IP

What is MIPI D-PHY Transmitter/Receiver for TSMC 22nm ULL?

MIPI D-PHY Transmitter/Receiver for TSMC 22nm ULL is a MIPI PHY IP core from Renesas listed on Semi IP Hub. It is listed with support for tsmc Available on request.

How should engineers evaluate this MIPI PHY?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this MIPI PHY IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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