Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application; UMC 55nm SP/RVT LowK Logic Process
- Controller + PHY + 1
- UMC
- 55nm
- SP
- Pre-Silicon
LPDDR Interface IP cores provide the controller, PHY, and training technologies required to connect SoCs and ASICs to low-power DRAM, enabling high memory bandwidth while minimizing energy consumption in power-sensitive applications.
This category includes IP solutions supporting LPDDR4, LPDDR5, LPDDR5X, and LPDDR6 memory standards. Available implementations may include memory controllers, PHYs, controller-PHY subsystems, initialization and training engines, power management features, ECC capabilities, and advanced signal integrity technologies optimized for mobile, AI, automotive, and edge computing platforms.
Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application; UMC 55nm SP/RVT LowK Logic Process
High performance, low power and area efficient memory interface solutions conforming to LPDDR5/5X (JESD209-5C) JEDEC standard
M31 LPDDR4X multi-PHY support DDR4, LPDDR4, and LPDDR4X up to 4267Mbps.
Data Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY for copper pillar bump Flip chip version ; UMC 40nm LP LowK Logic Process
Command/Address Block of DDR3/DDR4/LPDDR2/LPDDR3 Combo PHY supporting 2-rank application for Copper Pillar Bump Flip Chip Version…
Data Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application; UMC 55nm LP/RVT LowK Logic Process
Data Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application; UMC 55nm LP/RVT LowK Logic Process
Compensation Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for SIP Application; UMC 28nm HPC/RVT LowK Logic Process; Vertical v…
Compensation Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY; UMC 55nm LP/RVT LowK Logic Process
Compensation Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY; UMC 55nm LP/RVT LowK Logic Process
Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application; UMC 55nm LP/RVT LowK Logic Process
Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application; UMC 55nm LP/RVT LowK Logic Process
40nm LPDDR3-PHY Data block for LightCo ; UMC 40nm LP/LVT Logic Process
40nm LPDDR3-PHY Data block for LightCo ; UMC 40nm LP/LVT Logic Process
LPDDR3-PHY Command/address block for LightCo ; UMC 40nm LP/RVT Logic Process
LPDDR3-PHY Command/address block for LightCo ; UMC 40nm LP/RVT Logic Process
40nm LPDDR2-PHY data block for SIP
40nm LPDDR2-PHY data block for SIP
40nm LPDDR2-PHY command/address block for SIP
40nm LPDDR2-PHY command/address block for SIP
40nm LP DDR3/4 LPDDR23 COMBO PHY DATA Block for Flip Chip usage
40nm LP DDR3/4 LPDDR23 COMBO PHY DATA Block for Flip Chip usage
UMC 40nm LP process DDR34/LPDDR23 COMPENSATION Block with 2.5V Device
UMC 40nm LP process DDR34/LPDDR23 COMPENSATION Block with 2.5V Device
DDR3/DDR3L/LPDDR2 combo PHY ( not support DDR3 leveling function), data block;UMC 40nm LP/RVT LowK Logic Process .
DDR3/DDR3L/LPDDR2 combo PHY ( not support DDR3 leveling function), command / address block,UMC 40nm LP/RVT LowK Logic Process.
Data Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application (compliant to DFI); UMC 55nm SP/RVT LowK Logic Process