Vendor: Actt Category: High-Speed

Library of LVDS Ios cells in HLMC 28nm

This IP is a total solution for LVDS applications, including LVDS transmitter I/O, receiver I/O, common block and power/ground I/…

Overview

This IP is a total solution for LVDS applications, including LVDS transmitter I/O, receiver I/O, common block and power/ground I/O. LVDS transmitter and receiver support 1.2Gbps maximum data-rate. LVDS transmitter I/O can obtain good impedance matching by setting internal terminal impedance enable. There are multi-bits controlling signals to get different differential output swings and common mode voltage.
LVDS receiver I/O can receive differential signals with full-scale common voltage and small differential voltage.

Key features

  • ? Conforms to the TIA/EIA-644-A LVDS standard
  • ? Suitable for vertical placement
  • ? Data rate up to 1.2Gbps
  • ? Simple method for testing LVDS transmitter and receiver
  • ? 4-bit controlling signals to get different differential output swings
  • ? 4-bit controlling signals to get different common voltage
  • ? LVDS receiver receives differential signals with full-scale common voltage and small differential voltage
  • ? Operating temperature range: -40°C ~ +125°C

Applications

  • SoC Interconnection
  • Display,Video

Specifications

Identity

Part Number
Library of LVDS Ios cells in HLMC 28nm
Vendor
Actt
Type
Silicon IP

Provider

HQ: China

Learn more about High-Speed IP core

Frequently asked questions about High-Speed I/O Pad IP

What is Library of LVDS Ios cells in HLMC 28nm?

Library of LVDS Ios cells in HLMC 28nm is a High-Speed IP core from Actt listed on Semi IP Hub.

How should engineers evaluate this High-Speed?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this High-Speed IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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