What is IP Platform for BLE 5.2 IoT Sensors?
IP Platform for BLE 5.2 IoT Sensors is a Bluetooth IP core from Low Power Futures listed on Semi IP Hub.
Vendor:
Low Power Futures
Category:
Bluetooth
IP Platform for BLE 5.2 IoT Sensors
The LP1-100 IP Platform is built around the BLE 5.2 connectivity standard.
Overview
The LP1-100 IP Platform is built around the BLE 5.2 connectivity standard. This platform consists of a Bluetooth 5.2 Low Energy Controller and the LP-NNP IP. The LP1-100 IP Platform is designed to bring secure wireless connectivity to various ultra-low-power connected IoT devices, including beacons, secure RFID, asset tracking, wearable, health monitors, automotive, etc.
The LP1-100 IP Platform is fully integrated for better portability to different embedded processors, including ARM and RISCV. It is built for smooth integration into an SoC or used as the main foundation of a standalone SoC.
The LP1-100 IP Platform is fully integrated for better portability to different embedded processors, including ARM and RISCV. It is built for smooth integration into an SoC or used as the main foundation of a standalone SoC.
Key features
- LE 5.2 CONTROLLER :
- GFSK modem @ 2.4GHz (1M Uncoded PHY, 2M Uncoded PHY, 1M Coded PHY)
- Bitstream Processing (FEC convolutional encoder/decoder, Data whitening, CRC, AES CCM)
- Constant Tone Extension (IQ Sampling)
- Channel Selection Algorithm for connection events and sub events
- Broadcast Isochronous Stream
- Connection Supervision
- Link Layer Firmware and HCI
- NEURAL NETWORK PROCESSOR :
- Fully programmable
- Int16
- Fixed Point
- FP16
- Built-in prescaling and denormalization
- SECURITY ACCELERATOR :
- Protocol Supported : ECDHE, ECDSA
- Acceleration units : ECC, SHA256, AES 128
- TRNG
- AMBA standard interface : AXI/AHB/APB
Benefits
- Power and area-optimized
- Fully integrated for better portability to different embedded processors, including ARM and RISCV
- Built for smooth integration into an SoC or used as the main foundation of a standalone SoC
- Support for highly-differentiating products at a lower cost and time-to-market
- Complete UVM Verification environment
- End-to-end FPGA Validation Platform validated with qualified certification tools
Applications
- Smart and Secure Identification
- Wearables
- Hearing Aids
- Health Monitors
What’s Included?
- Delivered as Soft or Hard IP
- Link Layer Firmware and HCI
- FPGA Validation Platform
- UVM Test Bench
- Technical Specifications
- Integration Manual
Specifications
Identity
Part Number
LP1-100
Vendor
Low Power Futures
Type
Silicon IP
Files
Note: some files may require an NDA depending on provider policy.
Provider
HQ:
Canada
Frequently asked questions about Bluetooth IP cores
How should engineers evaluate this Bluetooth?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Bluetooth IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.