UCIe Controller baseline for Streaming Protocols
The UCIe Controller IP encompasses the Die-to-Die Adapter Layer and Protocol Layer for widely used protocols, such as PCI Express…
- UCIe
UCIe IP cores enable high-bandwidth die-to-die connectivity in advanced packaging and chiplet architectures in modern SoC and ASIC designs.
These IP cores support standardized die-to-die connectivity for chiplet-based architectures with high bandwidth and ecosystem interoperability, helping designers scale heterogeneous integration with better bandwidth density, packaging flexibility, and subsystem reuse
This catalog allows you to compare UCIe IP cores from leading vendors based on bandwidth, latency, power efficiency, and process node compatibility.
Whether you are designing chiplet SoCs, AI packages, data-center processors, or advanced packaging platforms, you can find the right UCIe IP for your application.
UCIe Controller baseline for Streaming Protocols
The UCIe Controller IP encompasses the Die-to-Die Adapter Layer and Protocol Layer for widely used protocols, such as PCI Express…
The Die-to-Die interface is a functional block that provides a data interface between two chip dies in the same package.
UCIe-S PHY for Standard Package (x16) in SS SF5A, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
Lightweight die-to-die interconnect solution consisting of the Physical Layer, Die-to-Die Layer and Protocol Layer optimized for …
Verification IP for Universal Chiplet Interconnect Express (UCIe) up to 3.0
Specifications: UCIe v1.0, v1.1, v2.0, v3.0 Interfaces: FDI/RDI/PHY link DUT Types/Topology D2D Adapter, Phy, Protocol, Full Stac…
The UCIe PHY & D2D Adapter IP portfolio includes 32Gbps UCIe- (UCIe-A) & Standard (UCIe-S) cores as per the latest UCIe v1.1 spec…
Support for multiple protocol PCIE/CXL/Streaming