ForwardEdge’s UCIe IP enables scalable die-to-die connectivity for chiplet-based SoCs.
- GlobalFoundries
- 12nm
- LP
UCIe IP cores enable high-bandwidth die-to-die connectivity in advanced packaging and chiplet architectures in modern SoC and ASIC designs.
These IP cores support standardized die-to-die connectivity for chiplet-based architectures with high bandwidth and ecosystem interoperability, helping designers scale heterogeneous integration with better bandwidth density, packaging flexibility, and subsystem reuse
This catalog allows you to compare UCIe IP cores from leading vendors based on bandwidth, latency, power efficiency, and process node compatibility.
Whether you are designing chiplet SoCs, AI packages, data-center processors, or advanced packaging platforms, you can find the right UCIe IP for your application.
ForwardEdge’s UCIe IP enables scalable die-to-die connectivity for chiplet-based SoCs.
TSMC 3nm UCIe-A 32G Die to Die Interface
TSMC 3nm UCIe-A 32G Die to Die Interface
TSMC 5nm UCIe-A 32G LP Die to Die Interface
TSMC 5nm UCIe-A 32G LP Die to Die Interface
The UCIe-S 64GT/s PHY IP is a cutting-edge solution designed to meet the growing demand for ultra-high-speed interconnects betwee…
The UCIe-A 64GT/s PHY IP is a cutting-edge solution designed to meet the growing demand for ultra-high-speed interconnects betwee…
Lightweight die-to-die interconnect solution consisting of the Physical Layer, Die-to-Die Layer and Protocol Layer optimized for …
Support for multiple protocol PCIE/CXL/Streaming