AMD Receives All Necessary Approvals for Proposed Acquisition of Xilinx
AMD (NASDAQ: AMD) today announced that it has received approval from all necessary authorities to proceed with the acquisition of Xilinx, Inc. (NASDAQ: XLNX).
Vendor:
Xilinx, Inc.
Category:
GPIO
I/O Module
The LogiCORE™ I/O Module is a integrated and light-weight implementation of a standard set of peripherals.
Overview
The LogiCORE™ I/O Module is a highly integrated and light-weight implementation of a standard set of peripherals. The I/O Module is a standalone version of the tightly coupled I/O Module included in the LogiCORE MicroBlaze™ Micro Controller System (MCS). Using the I/O Module, a system equivalent to MicroBlaze MCS can be design using the ISE® Design Suite Embedded Edition.
Key features
- LMB v1.0 bus interfaces to communicate with MicroBlaze
- I/O Bus
- Interrupt Controller with fast interrupt mode support
- UART
- Fixed Interval Timers
- Programmable Interval Timers
- General Purpose Inputs
- General Purpose Outputs
Specifications
Identity
Part Number
I/O Module
Vendor
Xilinx, Inc.
Type
Silicon IP
Files
Note: some files may require an NDA depending on provider policy.
Provider
HQ:
USA
Learn more about GPIO IP core
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AMD and Xilinx Provide Update Regarding Expected Timing of Acquisition Close
AMD (NASDAQ: AMD) and Xilinx, Inc. (NASDAQ: XLNX) today released the following statement related to the status of global regulatory approvals for AMD’s proposed acquisition of Xilinx.
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Frequently asked questions about GPIO Pad Library IP cores
What is I/O Module?
I/O Module is a GPIO IP core from Xilinx, Inc. listed on Semi IP Hub.
How should engineers evaluate this GPIO?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this GPIO IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.