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Vendor:
VeriSilicon Microelectronics (Shanghai) Co., Ltd.
Category:
MIPI PHY
GLOBALFOUNDRIES 22nm FDX MIPI CDPHY Master V2.1/V3.0
This is a DPHY IP compliant to the “MIPI Alliance Spec for C-PHY v2.1 and D-PHY v3.0”, which consists of Bi-directional 1-Clock a…
Overview
This is a DPHY IP compliant to the “MIPI Alliance Spec for C-PHY v2.1 and D-PHY v3.0”, which consists of Bi-directional 1-Clock and 4-Data lanes. It can support Slave side. Each lane supports 2.5Gbps in High-Speed mode and 10Mbps/lane in Low-Power escape mode. The target applications are CSI-2 and DSI physical layers.
Key features
- Process: GLOBALFOUNDARIES 22nm FDSOI 0.8V/1.8V
- 80 to 6000 Mbps data rate per lane in DPHY HS mode
- 80 to 4500 Msps symbol rate per lane in CPHY HS mode
- All lanes support HS and ULPS modes in forward direction
- All lanes support Escape (LPDT, Trigger) mode in forward direction
- D0 lane support reverse Escape mode (LPDT, Trigger) and Turn-Around
- Support New power-saving HS-Tx half swing mode for D-PHY
- Support Un-terminated Mode Support HS-IDLE mode for D-PHY
- Support LVHS mode for C-PHY
Silicon Options
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| GlobalFoundries | 22nm | FDX | Pre-Silicon |
Specifications
Identity
Part Number
GF22FDSOIV18_CDPHYTX_02
Vendor
VeriSilicon Microelectronics (Shanghai) Co., Ltd.
Type
Silicon IP
Standards & Interfaces
MIPI PHY
MIPI D-PHY
Provider
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Frequently asked questions about MIPI PHY IP
What is GLOBALFOUNDRIES 22nm FDX MIPI CDPHY Master V2.1/V3.0?
GLOBALFOUNDRIES 22nm FDX MIPI CDPHY Master V2.1/V3.0 is a MIPI PHY IP core from VeriSilicon Microelectronics (Shanghai) Co., Ltd. listed on Semi IP Hub. It is listed with support for globalfoundries Pre-Silicon.
How should engineers evaluate this MIPI PHY?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this MIPI PHY IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.