MIPI DPHY_RX v1.2, 2C4D, UMC 28HPC+, E/W orientation
The D-PHY is a popular MIPI physical layer developed for mobile applications because it is a flexible, high-speed, low-power and …
- MIPI D-PHY
- UMC
- 28nm
- HPC
PHY and SerDes IP cores are essential building blocks for high-speed data transmission in modern semiconductor designs. This category includes physical layer IP and serializer/deserializer solutions used to implement reliable chip-to-chip, die-to-die, backplane and interface connectivity across networking, compute, storage, automotive and consumer applications.
Browse PHY / SerDes semiconductor IP for high-speed interfaces requiring robust signal integrity, scalable lane configurations, low power and standards-oriented interoperability. Compare controller-adjacent PHY IP, generic SerDes architectures and specialized high-speed connectivity solutions from multiple vendors for integration into ASICs, SoCs and advanced package designs.
MIPI DPHY_RX v1.2, 2C4D, UMC 28HPC+, E/W orientation
The D-PHY is a popular MIPI physical layer developed for mobile applications because it is a flexible, high-speed, low-power and …
MIPI DPHY_TX v1.2, 1C4D, UMC 28HPC+, E/W orientation
The D-PHY is a popular MIPI physical layer developed for mobile applications because it is a flexible, high-speed, low-power and …
USB2.0 build-in clock PHY, UMC 40LP, type-C
In USB product series, M31 not only provides customers with a standard USB PHY solution, but also offers a unique BCK function.
USB3.0 build-in clock PHY, UMC 40LP, type-C
In USB product series, M31 not only provides customers with a standard USB PHY solution, but also offers a unique BCK function.
16Gbps multi-protocol programmable SerDes PHY in UMC 28HPC+
Faraday 16Gbps multi-protocol programmable SerDes PHY IP in UMC 28HPC+ process is designed with a system-level approach to provid…
PSI2488-U9 is a GPON ONT SERDES capable of receiving serial data at the rate of 2.488Gbps and transmitting data at the rate of 1.…
USB2.0 Dual-Role PHY, UMC 28HPC+, N/S orientation
M31 provides customers the next generation of USB 2.0 IP with an extremely compact die area and lower active and suspend power co…
USB 3.1 Gen.1 TYPE-C PHY ; UMC 40nm Logic/Mixed-Mode Low Power/RVT+LVT Process
USB 3.1 Gen.1 TYPE-C PHY ; UMC 40nm Logic/Mixed-Mode Low Power/RVT+LVT Process
Two Port OTG USB2.0 PHY;BOAC version; Wire bonding;UMC 40 nm LP/RVT process.
Two Port OTG USB2.0 PHY;BOAC version; Wire bonding;UMC 40 nm LP/RVT process.
USB 2.0 On-The-Go PHY; UMC 28nm HPC RVT Logic Process
USB 2.0 On-The-Go PHY; UMC 28nm HPC RVT Logic Process
USB 1.1 transceiver support crystal-less mode in USB system ; UMC 55nm eFlash Process
USB 1.1 transceiver support crystal-less mode in USB system ; UMC 55nm eFlash Process
USB1.1 PHY Feature USB 1.1 On-The-Go PHY; UMC 55nm Logic Low Power Low-K Process
USB1.1 PHY Feature USB 1.1 On-The-Go PHY; UMC 55nm Logic Low Power Low-K Process
USB1.1 PHY Feature USB 1.1 On-The-Go PHY; UMC 0.11um HS/AE (AL Enhancement) Logic Process, without internal power clamping circuit
UMC 28nm HPC/Low-K process , 1.25G-16Gbps 4-Lane SERDES
UMC 28nm HPC/Low-K process , 1.25G-16Gbps 4-Lane SERDES
3.3V LVDS Transmitter 16~100MHz; 55nm SP/RVT LowK Logic Process
3.3V LVDS Transmitter 16~100MHz; 55nm SP/RVT LowK Logic Process
2.5V LVDS Transmitter 1.25Gbps; UMC 40nm LP LowK Logic Process.
2.5V LVDS Transmitter 1.25Gbps; UMC 40nm LP LowK Logic Process.
3.3V LVDS Transmitter 700Mbps; UMC 40nm LP LowK Logic Process
3.3V LVDS Transmitter 700Mbps; UMC 40nm LP LowK Logic Process
3.3V FPD-link LVDS Transmitter 16~100MHz; UMC 28nm HPC process
3.3V FPD-link LVDS Transmitter 16~100MHz; UMC 28nm HPC process
2.5V FPD-link LVDS Transmitter 16~178.6MHz; UMC 40nm LP Low-K process
2.5V FPD-link LVDS Transmitter 16~178.6MHz; UMC 40nm LP Low-K process
3.3v LVDS RX, 3 data lane and 1 clock lane using UMC 40nm LP/RVT LowK Logic Process
3.3v LVDS RX, 3 data lane and 1 clock lane using UMC 40nm LP/RVT LowK Logic Process