Vendor: XtremeSilica Category: HBM

800G Low Latency Level3 Memory Sub System

Key features

  • Proven 800G Performance
  • Supports AXI4 Interface for configuration
  • Supports Various Vendors(Synopsys/Micron/Samsung/Xilinx) Memory Marcos
  • Low Latency
  • Supports memory interfaces of 8 to 128bits in 4 bit increments
  • Supports Configurable Data rates

Specifications

Identity

Part Number
memsubsys
Vendor
XtremeSilica
Type
Silicon IP
Controller / PHY
Controller

Files

Note: some files may require an NDA depending on provider policy.

Provider

HQ: India

Learn more about HBM IP core

Reducing Avoidable Memory Trips In HBM Systems

As AI and high-performance SoCs increasingly rely on HBM, memory bandwidth alone is no longer enough to maximize performance. This article discusses why the intelligent data movement and cache efficiency are critical to unlocking the full benefits of HBM-based architectures.

Making Strong Error-Correcting Codes Work Effectively for HBM in AI Inference

LLM inference is increasingly memory-bound, and HBM cost per GB now dominates system cost. Today’s HBM stacks include short on-die ECC, which tightens binning, raises price, and locks reliability policy inside the device. This paper asks a simple question: can we tolerate a much higher raw HBM bit error rate (BER) and still keep end-to-end correctness and throughput, without changing the HBM PHY or the fixed 32B transaction size?

High Bandwidth Memory Evolution from First Generation HBM to the Latest HBM4

HBM4 is the latest generation of the High Bandwidth Memory (HBM) that has become analogous to the Artificial Intelligence (AI) boom that is everywhere in today’s world. HBM is also increasingly being used in other applications like Data centers, autonomous driving systems, servers, cloud computing just to mention few domains where bandwidth and performance in a key requirement.

Breaking the HBM Bit Cost Barrier: Domain-Specific ECC for AI Inference Infrastructure

High-Bandwidth Memory (HBM) delivers exceptional bandwidth and energy efficiency for AI workloads, but its high cost per bit, driven in part by stringent on-die reliability requirements, poses a growing barrier to scalable deployment. This work explores a systemlevel approach to cost reduction by eliminating on-die ECC and shifting all fault management to the memory controller.

Frequently asked questions about HBM Interface IP

What is 800G Low Latency Level3 Memory Sub System?

800G Low Latency Level3 Memory Sub System is a HBM IP core from XtremeSilica listed on Semi IP Hub.

How should engineers evaluate this HBM?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this HBM IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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