TSMC looks to volume 7nm production in Q1 2018
September 12, 2016
TSMC intends to be in volume production on 7nm in Q1 2018, reports Digitimes, quoting Simon Wang, TSMC’s senior director of business development.
On 10nm, TSMC has received tape-outs on three designs and anticipates 10nm revenues in Q 2017.
To read the full article, click here
Related Semiconductor IP
- USB 2.0 femtoPHY -TSMC N6 18 x1, OTG, North/South (vertical) poly orientation
- USB 2.0 femtoPHY - TSMC N5 12 x1, North/South (vertical) poly orientation
- USB 2.0 femtoPHY - TSMC N3P 1.2V x1, North/South (vertical) poly orientation
- USB 2.0 picoPHY - TSMC 90LPFS33 x1, OTG
- USB 2.0 femtoPHY - TSMC 7FF18 x1, OTG, North/South (vertical) poly orientation
Related Blogs
- TSMC 28nm Beats Q1 2012 Expectations!
- GlobalFoundries Looks For 7nm Leadership
- TSMC 16nm, 10nm, 7nm, and 5nm Update!
- TSMC Technology Symposium 2018
Latest Blogs
- FiRa 3.0 Use Cases: Expanding the Future of UWB Technology
- Cadence Announces Industry's First Verification IP for Embedded USB2v2 (eUSB2v2)
- The Industry’s First USB4 Device IP Certification Will Speed Innovation and Edge AI Enablement
- Understanding Extended Metadata in CXL 3.1: What It Means for Your Systems
- 2025 Outlook with Mahesh Tirupattur of Analog Bits