Compensation Block of DDR3 Combo PHY for DIMM version ; UMC 55nm LP/RVT LowK Logic Process
Compensation Block of DDR3 Combo PHY for DIMM version ; UMC 55nm LP/RVT LowK Logic Process
- Controller + PHY + 1
- DDR3
- UMC
- 55nm
- LP
- Pre-Silicon
Memory interface IP cores provide the critical connectivity layer between processing elements and memory devices, enabling high-bandwidth, low-latency, and power-efficient data access in modern SoC, ASIC, AI, networking, and high-performance computing designs.
This category includes DDR, LPDDR, GDDR, HBM, NAND Flash, and NOR Flash interface IP solutions, covering memory controllers, PHYs, controller-PHY subsystems, training engines, calibration logic, and complete memory interface architectures. These IP cores are designed to maximize memory bandwidth, optimize latency, ensure signal integrity, and simplify integration across advanced semiconductor process nodes.
Compensation Block of DDR3 Combo PHY for DIMM version ; UMC 55nm LP/RVT LowK Logic Process
Compensation Block of DDR3 Combo PHY for DIMM version ; UMC 55nm LP/RVT LowK Logic Process
Compensation Block of DDR3 Combo PHY for DIMM version ; UMC 55nm SP/RVT LowK Logic Process
Compensation Block of DDR3 Combo PHY for DIMM version ; UMC 55nm SP/RVT LowK Logic Process
DDR23 COMBO PHY compensation Block ; UMC 40LP/RVT LowK Logic Process with 2.5V device
DDR23 COMBO PHY compensation Block ; UMC 40LP/RVT LowK Logic Process with 2.5V device
DDR2/3 COMBO Compensation block (2.5V IO device) ; UMC 90nm SP-RVT LowK Logic Porcess
DDR2/3 COMBO Compensation block (2.5V IO device) ; UMC 90nm SP-RVT LowK Logic Porcess
Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application (compliant with DFI spec); UMC 40nm LP LowK …
Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application;UMC 55nm SP/RVT LowK PROCESS.
Command/Address Block of DDR3/DDR3L/DDR2/LPDDR2/LPDDR Combo PHY for Chip Application; UMC 55nm SP/RVT LowK Logic Process
Command/Address Block of DDR3 Combo PHY for DIMM version ; UMC 55nm LP/RVT LowK Logic Process
Command/Address Block of DDR3 Combo PHY for DIMM version ; UMC 55nm LP/RVT LowK Logic Process
Command/Address Block of DDR3 Combo PHY for DIMM version ; UMC 55nm SP/RVT LowK Logic Process
Command/Address Block of DDR3 Combo PHY for DIMM version ; UMC 55nm SP/RVT LowK Logic Process
DDR23 COMBO PHY CMD/ADDR BLOCK ; UMC 40LP/RVT LowK Logic Process with 2.5V device for 2 layer PCB board usage
DDR3/2 COMBO PHY CMD/ADDR BLOCK for 2 layer 8 bits DDR3 PCB ; UMC 40LP/RVT LowK Logic Process with 2.5V device
DDR23 COMBO PHY CMD/ADDR BLOCK ; UMC 40LP/RVT LowK Logic Process with 2.5V device
DDR23 COMBO PHY CMD/ADDR BLOCK ; UMC 40LP/RVT LowK Logic Process with 2.5V device
DDR2/3 Combo Command /Address Block (with 2.5V IO device) ; UMC 90nm SP-RVT LowK Logic Process
DDR2/3 Combo Command /Address Block (with 2.5V IO device) ; UMC 90nm SP-RVT LowK Logic Process
DDR2-PHY data block; UMC 90nm SP/RVT Lowk Process
DDR2-PHY data block; UMC 90nm SP/RVT Lowk Process
DDR2-PHY data block with BOAC IO; UMC 90nm SP/RVT Lowk Logic Process
DDR2-PHY data block with BOAC IO; UMC 90nm SP/RVT Lowk Logic Process
DDRII Data Block for Chip Application; UMC 0.13um HS/FSG Logic Process
DDRII Data Block for Chip Application; UMC 0.13um HS/FSG Logic Process
DDR2 PHY Data Block ;UMC 0.13um Logic HS/FSG Process
DDR2 PHY Data Block ;UMC 0.13um Logic HS/FSG Process
DDR2-PHY Command/Address block; UMC 90nm SP/RVT Lowk Process
DDR2-PHY Command/Address block; UMC 90nm SP/RVT Lowk Process
DDR2-PHY command/address block for DRAM chip, BOAC ; UMC 90nm SP/RVT Low-K Logic Process
DDR2-PHY command/address block for DRAM chip, BOAC ; UMC 90nm SP/RVT Low-K Logic Process
DDR2 PHY Command/Address Block (for Chip Application); UMC 0.13um HS/FSG Logic Process
DDR2 PHY Command/Address Block (for Chip Application); UMC 0.13um HS/FSG Logic Process