HBM2E PHY V2 (Hard 1) - TSMC 7FF18
graphics, high-performance computing (HPC) and networking applications are requiring more memory bandwidth to keep pace with the …
- Controller + PHY + 1
- TSMC
- 7nm
- N7FF
Memory interface IP cores provide the critical connectivity layer between processing elements and memory devices, enabling high-bandwidth, low-latency, and power-efficient data access in modern SoC, ASIC, AI, networking, and high-performance computing designs.
This category includes DDR, LPDDR, GDDR, HBM, NAND Flash, and NOR Flash interface IP solutions, covering memory controllers, PHYs, controller-PHY subsystems, training engines, calibration logic, and complete memory interface architectures. These IP cores are designed to maximize memory bandwidth, optimize latency, ensure signal integrity, and simplify integration across advanced semiconductor process nodes.
HBM2E PHY V2 (Hard 1) - TSMC 7FF18
graphics, high-performance computing (HPC) and networking applications are requiring more memory bandwidth to keep pace with the …
HBM2E PHY V2 (Hard 1) - TSMC 6FF18
graphics, high-performance computing (HPC) and networking applications are requiring more memory bandwidth to keep pace with the …
HBM2E PHY V2 (Hard 1) - TSMC 5FF12
graphics, high-performance computing (HPC) and networking applications are requiring more memory bandwidth to keep pace with the …
The HBM3 PHY is a physical layer IP interface (PHY) solution for high-performance computing (HPC), AI, graphics, and networking A…
The HBM3 PHY is a physical layer IP interface (PHY) solution for high-performance computing (HPC), AI, graphics, and networking A…
The HBM3 PHY is a physical layer IP interface (PHY) solution for high-performance computing (HPC), AI, graphics, and networking A…
The HBM3 PHY is a physical layer IP interface (PHY) solution for high-performance computing (HPC), AI, graphics, and networking A…
HBM3 V2 Solution enabling access to HBM3 Controller and HBM3 PHY in TSMC N3E
The HBM3 Controller IP is optimized for power, latency, bandwidth, and area, supporting the JEDEC HBM3 standard.
The DDR3/2 PHY cores are mixed-signal PHY IP cores that supply the physical interface to JEDEC standard DDR3 and DDR2 SDRAM memor…
The DDR4 multiPHY IP cores are mixed-signal PHY IP cores that supply the physical interface to JEDEC standard DDR4, DDR3, LPDDR2,…
The DDR4 multiPHY IP cores are mixed-signal PHY IP cores that supply the physical interface to JEDEC standard DDR4, DDR3, LPDDR2,…
The LPDDR4 multiPHY is the second generation physical (PHY) layer IP interface solution for ASICs, ASSPs, system-on-chips (SoCs) …
LPDDR4 multiPHY V2 - SS 8LPP for Automotive AEC-Q100 Grade 1
The LPDDR4 multiPHY is the second generation physical (PHY) layer IP interface solution for ASICs, ASSPs, system-on-chips (SoCs) …
The LPDDR4 multiPHY is the second generation physical (PHY) layer IP interface solution for ASICs, ASSPs, system-on-chips (SoCs) …
The LPDDR4 multiPHY is the second generation physical (PHY) layer IP interface solution for ASICs, ASSPs, system-on-chips (SoCs) …
The LPDDR4 multiPHY is the second generation physical (PHY) layer IP interface solution for ASICs, ASSPs, system-on-chips (SoCs) …
The LPDDR4 multiPHY is the second generation physical (PHY) layer IP interface solution for ASICs, ASSPs, system-on-chips (SoCs) …
The LPDDR4 multiPHY is the second generation physical (PHY) layer IP interface solution for ASICs, ASSPs, system-on-chips (SoCs) …
The LPDDR4 multiPHY is the second generation physical (PHY) layer IP interface solution for ASICs, ASSPs, system-on-chips (SoCs) …
The LPDDR4 multiPHY is the second generation physical (PHY) layer IP interface solution for ASICs, ASSPs, system-on-chips (SoCs) …