Xilinx CTO: FPGA can drive the crossover SoC
Peter Clarke, EETimes
2/2/2011 6:12 PM EST
SANTA CLARA, Calif. – Ivo Bolsens, chief technology officer of field programmable gate array vendor Xilinx Inc., sees a future where FPGAs are a fundamental part of the system-on-chip, either merged monolithically with software programmable microprocessor cores or making use of multi-die configurations in three dimensional system-in-packages.
Speaking as a keynoter at the DesignCon conference here, Bolsens laid out the concept of the crossover SoC as something similar to the crossover automobile, which combines the attributes of a sports car, passenger vehicle and a station wagon.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Bluespec, Inc. Releases Ultra-Low Footprint RISC-V Processor Family for Xilinx FPGAs, Offers Free Quick-Start Evaluation.
- Logic Design Solutions Launches NVME Host IP on Xilinx Ultrascale & Ultrascale Plus FPGA
- GOWIN Semiconductor & Andes Technology Corp. Announce The First Ever RISC-V CPU and Subsystem Embedded 22nm SoC FPGA
- Logic Fruit Technologies Elevates FPGA Innovation with AMD Xilinx Premier Partnership
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release