Xilinx CTO: FPGA can drive the crossover SoC
Peter Clarke, EETimes
2/2/2011 6:12 PM EST
SANTA CLARA, Calif. – Ivo Bolsens, chief technology officer of field programmable gate array vendor Xilinx Inc., sees a future where FPGAs are a fundamental part of the system-on-chip, either merged monolithically with software programmable microprocessor cores or making use of multi-die configurations in three dimensional system-in-packages.
Speaking as a keynoter at the DesignCon conference here, Bolsens laid out the concept of the crossover SoC as something similar to the crossover automobile, which combines the attributes of a sports car, passenger vehicle and a station wagon.
To read the full article, click here
Related Semiconductor IP
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
- AMBA Bus Host to eSPI Controller
Related News
- Logic Design Solutions Launches NVME Host IP on Xilinx Ultrascale & Ultrascale Plus FPGA
- GOWIN Semiconductor & Andes Technology Corp. Announce The First Ever RISC-V CPU and Subsystem Embedded 22nm SoC FPGA
- Logic Fruit Technologies Elevates FPGA Innovation with AMD Xilinx Premier Partnership
- Microchip FPGAs Speed Intelligent Edge Designs and Reduce Development Cost and Risk with Tailored PolarFire® FPGA and SoC Solution Stacks
Latest News
- Alliance for Open Media Releases AV2 Codec, Advancing Next-Generation Open Video Coding
- VeriSilicon Drives Commercial Adoption of AV2 Across Next-Generation Video and Streaming Applications
- Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs
- Menta and Presto Engineering Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology
- MIPI A-PHY To Power Industry’s First Four-Company Automotive SerDes Interoperability Demonstration at AutoSens USA