V3, Infineon collaborate in design boards for TriCore processors
V3, Infineon collaborate in design boards for TriCore processors
By Semiconductor Business News
September 27, 2000 (9:00 a.m. EST)
URL: http://www.eetimes.com/story/OEG20000927S0003
TORONTO--V3 Semiconductor Inc. here today announced a new development board and collaboration with Infineon Technologies AG to support single-board computers with embedded PCI interfaces. V3's new evaluation and reference-design system supports embedded PCI applications using Infineon's TriCore Unified Processor Architecture. The company said the new development board supports TriCore processors running at 66 MHz and V3's Universal System Controller (USC) architecture for embedded PCI designs. A key factor in Infineon's selection of V3's V320USC controller was its direct memory access (DMA) and SDRAM control features, as well as simple interface to the TriCore processors, said Oliver Garreau, TriCore applications engineering manager for the Munich-based company. The V320USC enables the system to operate in one of two modes: stand-alone master mode, withself-boot and plug-and-play capability, or PCI adapter card slave-only mode, said V3 . The new development board, called the TriCore Single-Board Computer (TSBC), can accommodate up to three PCI 32-bit target boards in stand-alone operation. In PCI-target board mode, a 32-bit card edge PCI connector can be used to plug a PC to the board. The PCO TSBC development kit will be available by the end of the year for less than $1,000, including 32 megabytes of SDRAM and 24 megabytes of flash.
Related Semiconductor IP
- Ultra Ethernet MAC & PCS 100G/200G/400G/800G
- Ethernet PCS 100G/200G/400G/800G/1.6T
- Ethernet MAC 100G/200G/400G/800G/1.6T
- Junction Over-Temperature Detector with Linear Centigrade-to-Voltage Output - X-FAB XT018
- Performance P570 Gen 3
Related News
- Express Logic Provides Support for Infineon TriCore Microcontrollers
- Infineon, POLYN to Collaborate on Advanced Tire Monitoring Products
- Andes and Arculus System Collaborate to Integrate iPROfiler™ into AndeSysC, Expanding Virtual Platform Support for RISC-V SoC Design
- Cadence and Google Collaborate to Scale AI-Driven Chip Design with ChipStack AI Super Agent on Google Cloud
Latest News
- SkyeChip Berhad Delivers 35.0% Net Profit Growth Ahead of Main Market Debut on 20 May 2026
- Quantum eMotion and JMEM TEK Sign Consortium Agreement to Accelerate Quantum-Resilient Semiconductor SoC Development
- Silvaco Announces Immediate Availability of Mixel MIPI C-PHY/D-PHY Combo IP on TSMC N2P Process
- BrainChip Strikes IP Licensing Deal with ASICLAND
- Arteris Technology Adopted by Li Auto for Intelligent Vehicles