Report: TSMC confirms U.S. wafer fab site hunt
Peter Clarke, EETimes
12/20/2012 4:37 AM EST
LONDON – Amid plans to increase capital spending to a record $9 billion in 2013, Taiwanese foundry TSMC is seeking a location for a wafer fab, with the U.S. as a possibility, according to a local news report.
To read the full article, click here
Related Semiconductor IP
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 12nm FFC
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 22nm ULP
- 32Gbps SerDes IP in TSMC 12nm FFC
- 32Gbps SerDes IP in TSMC 22nm ULP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- Key ASIC Signed LOI to Acquire Wafer FAB in The US
- TSMC 6-inch Wafer Fab Exit Affirms Strategy Shift
- Taiwan Maintains Largest Share of Global IC Wafer Fab Capacity
- Taiwan Maintains The Largest Share of Global IC Wafer Fab Capacity
Latest News
- JEDEC Advances DDR5 MRDIMM Ecosystem with New Memory Interface Logic and Expanded MRDIMM Roadmap
- Altera Brings Determinism to Physical AI Systems with Latest Release of FPGA AI Suite
- Mosaic SoC raises $3.8M to bring real-time spatial intelligence to every consumer device
- UMC Reports First Quarter 2026 Results
- Rambus Appoints Sumeet Gagneja as Chief Financial Officer