TSMC sees Q3 demand as it solidifies roadmap
Mark LaPedus, EE Times
(09/02/2009 9:21 PM EDT)
SAN JOSE, Calif. -- As it solidifies its process roadmap, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) continues to see a surge in business.
After a slump in the first quarter, TSMC (Hsinchu, Taiwan) rebounded and recently posted strong results in the second quarter. The company also raised its capital spending to $2.3 billion for 2009. Its capital spending budget is projected to exceed $2 billion in 2010, according to analysts.
And in the meantime, the foundry giant is seeing better-than-expected sales demand in the third quarter of 2009, according to an analyst. ''Checks with TSMC lead us to believe 3Q guidance of plus 20 percent could move to around 25 percent with computing/graphics leading, followed by communications and then consumer,'' said C.J. Muse, an analyst with Barclays Capital, in a new report based on company visits in Taiwan this week.
(09/02/2009 9:21 PM EDT)
SAN JOSE, Calif. -- As it solidifies its process roadmap, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) continues to see a surge in business.
After a slump in the first quarter, TSMC (Hsinchu, Taiwan) rebounded and recently posted strong results in the second quarter. The company also raised its capital spending to $2.3 billion for 2009. Its capital spending budget is projected to exceed $2 billion in 2010, according to analysts.
And in the meantime, the foundry giant is seeing better-than-expected sales demand in the third quarter of 2009, according to an analyst. ''Checks with TSMC lead us to believe 3Q guidance of plus 20 percent could move to around 25 percent with computing/graphics leading, followed by communications and then consumer,'' said C.J. Muse, an analyst with Barclays Capital, in a new report based on company visits in Taiwan this week.
To read the full article, click here
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related News
- Artisan Components Furthers Library Roadmap with TSMC 0.13-Micron Agreement
- 1999 roadmap targets new 'performance SoC' category
- Intel and ARM Finalize Architecture Roadmap Licensing Agreement
- Actel Details Next Phase In Space-Qualified FPGA Roadmap; Aggressively Targets Satellite Payload Applications
Latest News
- First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC
- MIPS Leads Open Standards Development for Physical AI Platforms as RISC-V International Premier Member
- SEALSQ’s Subsidiary IC'Alps Advances QASIC Roadmap for Sovereign, Quantum-Resistant Application-Specific Integrated Circuits
- NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
- Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers